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    Explosives trace detector approved for passenger and baggage screening at US ... - Government Security News
      Wilmington, MA-based Implant Sciences Corporation, a high technology supplier of systems and sensors for homeland security and defense markets, has announced that its QS-B220 desktop explosives t ....more | Save |  Share  Email 1st Sep 2014 
     
    Subaru appeals to driver's sense of adventure with interactive campaign - The Drum
      As well as several 'how-to' video guides on making the most of outdoor related activities, the campaign also features XV inspired hints and tips that will be sent out via social media to widen the campaign re ....more | Save |  Share  Email 1st Sep 2014 
     
    SMC Exhibit "Sight Readings" From Artist Roxanne Sexauer Opens Tuesday - Santa Monica Mirror
      This direction continues to inform her images, which in recent years combine lithography, silkscreen, and collagraphy. "I have seen her imagery progress for two decades,? said Fuglie. "Roxanne's ....more | Save |  Share  Email 1st Sep 2014 
     
    Zacks Reiterates "Neutral" Rating for Arrow Electronics (ARW) - Intercooler
      Results also improved year over year and Arrow had a favorable book to bill ratio. Moreover, positive commentary about enhanced productivity and continued higher contributions from Europe are encouraging. However, the ....more | Save |  Share  Email 1st Sep 2014 
     
    Singapore's economy moving up the value chain - Channel News Asia
      Channel News Asia Mr Andrew Chong, president and managing director of Infineon Technologies Asia Pacific, said: "As the complexity increased in semiconductor industry, testing has become a key differentiator. One of the features ....more | Save |  Share  Email 1st Sep 2014 
     
    Research and Markets: Global and Chinese IC Advanced Packaging Equipment ... - Business Wire (press release)
      Wafer level packaging is primarily used in the following 5 fields, namely, Analog & Mixed Signal (including IPD, PA, PMU, Local Power, IC Driver, and Audio & Video), Wireless Connectivit ....more | Save |  Share  Email 1st Sep 2014 
     
    New report looks into Global system in package (SiP) market that is poised to ... - WhaTech
      The major packaging technologies that have been extensively covered in the report are 2D, 2.5D, and 3D IC packaging; the packaging types covered are Ball Grid Array (BGA), Surface Mount Technology (SMT), Quad Fl ....more | Save |  Share  Email 1st Sep 2014 
     
    DRAM whammer Kaminario bigs up K2 biz - Register
      Comment Upstart Kaminario seems pleased with its position at the summit of flash array performance with its SPC benchmark-topping K2 all-flash arrays. But this mid-pack player may need to emerge from the herd to prove it has what it takes. Gartner pegs&n ....more | Save |  Share  Email 1st Sep 2014 
     
    MPU Kesulitan BBM, Pelajar di Lumajang Terlambat ke Sekolah - Suarasurabaya.net
      "Sehingga, awak MPU pun mengantisipasi dengan antri pagi-pagi. Kalaupun antrian itu selama berjam-jam sebelum mendapatkan BBM, dampaknya memang operasional mereka terjadi molor. Alhasil, penumpang memang kesulitan angkutan ....more | Save |  Share  Email 1st Sep 2014 
     
    Improving printed electronics process and device characterization - Phys.Org
      By building up components layer by layer, Advantech is able to create complex devices with features in the size range of 3-50 micrometers, filling an important size gap between nanoscale lithography and printed circuit board m ....more | Save |  Share  Email 1st Sep 2014 
     
    N-FET pre-driver IC suits high current DC motor applications - New Electronics
      New Electronics Its built-in EEPROM memory provides end-of-line (EoL) configurability, so that the customer can configure the device to their specific system design requirements. The MLX83100 also comprises a curre ....more | Save |  Share  Email 1st Sep 2014 
     
    Static, dynamic data integration improves reservoir modeling, characterization - Oil & Gas Journal (subscription)
      Oil & Gas Journal (subscription) ... Arab-D reservoir, due to the heterogeneous pore structure caused by depositional environments and diagenesis, such as dolomitization, compaction, cementa ....more | Save |  Share  Email 1st Sep 2014 
     
    US researchers show new way of growing III-V layers on Si - Compound Semiconductor
      According to the researchers, the compatibility of their growth technique with current silicon planar CMOS technology presents an important step towards integrating electronics and photonics on the same chip. Application ....more | Save |  Share  Email 1st Sep 2014 
     
    Testing Solder Joint Fatigue on Printed Circuit Boards using Bi-Directional ... - Azom.com
      Dage was founded in 1961 and is a market leader in its chosen markets of Semiconductor and PCBA Manufacture. It has an award winning portfolio of Bondtester and X-ray Inspection Systems for destructive and non-de ....more | Save |  Share  Email 1st Sep 2014 
     
    NXP launches platform for NFC interaction with devices - Telecompaper (subscription)
      By combining a contactless NFC interface with a contact IC interface and onboard non-volatile memory, the NTAG IC platform enables new kinds of NFC tag interactions, including advanced device pairing, pers ....more | Save |  Share  Email 1st Sep 2014 
     
    Nasa's Opportunity Mars Rover Set for Memory Reformat - NDTV
      NDTV The US space agency is preparing to download all useful data remaining in Opportunity's flash memory to earth and switch the rover to an operating mode that does not use flash memory. Flash memory retains data even when power is o ....more | Save |  Share  Email 1st Sep 2014 
     
    Nasa's Mars rover set for memory reformat - Times of India
      Times of India Nasa's Mars rover set for memory reformat. Nasa's Mars exploration rover Opportunity is set for a flash memory reformatting after experiencing an increasing number of computer resets. RELATED. Navi Mumbai students take ....more | Save |  Share  Email 31st Aug 2014 
     
    CyberOptics Features Advanced WaferSenseAE Airborne Particle Sensor (APS ... - Business Wire India (press release)
      CyberOpticsAE Corporation (NASDAQ:CYBE), a world leader in intelligent inspection and sensing solutions for electronics assembly and semiconductor process equipment, will demonstrate its w ....more | Save |  Share  Email 31st Aug 2014 
     
    IC stocks up ahead of SEMICON Taiwan exhibition - Focus Taiwan News Channel
      1 (CNA) The local integrated circuit sector moved higher Monday on expectations that the upcoming annual SEMICON Taiwan exhibition will come up with positive leads to help IC stocks spark more buying interest, dealer ....more | Save |  Share  Email 31st Aug 2014 
     
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