IC Industry: Trends in Society and Technology

IC Industry: Trends in Society and Technology

Loading
Loading Social Plug-ins...
Language: English
Save to myLibrary Download PDF
Go to Page # Page of 56

Description: The IC industry is moving from business to consumer to society driven industry. Semiconductors make an industry possible, More and More-than-Moore to go hand in hand for High Value Systems and new business, Not only IC technology, also packaging and assembly are going beyond visualization! Also discussed: Evolution in assembly & packaging, Evolution towards Microsystems, Energy consumption in consumer electronics, GreenChip–Breakthrough in PC power, CFL Driver IC in HV SOI technology, and more.

 
Author: RenéPenning de Vries (Fellow) | Visits: 1590 | Page Views: 1598
Domain:  High Tech Category: Semiconductors 
Upload Date:
Short URL: http://www.wesrch.com/electronics/pdfEL1SE1000NUUG
Loading
Loading...



px *        px *

* Default width and height in pixels. Change it to your required dimensions.

 
Contents:
From Living Faster to Living Better
Ren� Penning de Vries Ren� Penning de Vries CTO of NXP Semiconductors CTO of NXP Semiconductors

28 April 2009

Outline
Trends in society Trends in technology Solutions Conclusions

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

2

Outline
Trends in society Trends in technology Solutions Conclusions

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

3

IC industry: from business driven....

Source: Intel Corporation

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

4

....to consumer driven ...

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

5

...to society driven
Health & wellness Transport & mobility Security & safety

Energy & environment
2009 VLSI-TSA Symposium

Communication

E-society
Ren� Penning de Vries, NXP Semiconductors

6

Our industry has made our lives faster
Data for 2008 (GDP ~ $50,000B)

Services

~ $ 5,000B $ 1,200B $ 248B $ 80B

Telecom, Internet, Broadcast Consumer, Medical, Transport, Security, Space

Electronic Systems

Semiconductors Materials and equipment

Cornerstone of high-tech economy

Built on R&D strength
Source: TI 7 7

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

And now it has to make our lives better ...
..by solving the Top 10 problems for Humanity...
1. Energy 2. Water 3. Food 4. Environment 5. Poverty 6. Terrorism & war 7. Disease 8. Education 9. Democracy 10. Population

2003: 6.3 billion people 2050: ~10 billion people
Source: MIT Forum 2003
Ren� Penning de Vries, NXP Semiconductors

2009 VLSI-TSA Symposium

8

From faster to better
a paradigm shift in the industry
Productivity era
Making life faster

Value add era
Making life better
(safety, health, environment)

Mainstream markets Many functions in one chip (SoC) Digital, Moore's Law

Niche markets Dedicated functionality "More than Moore"
Analog, power, mechatronics, ...

Today
2009 VLSI-TSA Symposium
Ren� Penning de Vries, NXP Semiconductors

9

From Faster to Better; from Product to Service

Source: Jean-Philippe Dauvin, ST
2009 VLSI-TSA Symposium
Ren� Penning de Vries, NXP Semiconductors

10

...from living faster to living better...
2009 VLSI-TSA Symposium
Ren� Penning de Vries, NXP Semiconductors

11

Outline
Trends in society Trends in technology Solutions Conclusions

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

12

Semiconductor make an industry possible
Cost reduction trend - 35% per year $100,000 $10,000 Cost per function $1,000 Intel X86 is cost per MIP $100 $10 $1 DRAM is cost per megabit $0.1 $0.01 1960

1970

1980

Source: Scotten W. Jones, 2004 - IC Knowledge 2009 VLSI-TSA Symposium

1990 Year

2000

2010

2020

Ren� Penning de Vries, NXP Semiconductors

13

More and More-than-Moore to go hand in hand for High Value Systems and new business
More than Moore: Enrichment
Analog/RF Passives HV Power Sensors Actuators Biochips

Baseline CMOS: CPU, Memory, Logic

More Moore: Miniaturization

130nm 90nm 65nm 45nm 32nm 22nm . . . V
Co m bi
Information Processing Digital content System-on-chip (SoC)

ni ng

Sense, Interact, Empower Heterogeneous content System-in-package (SiP)

So C

an d

Si

P:

Hi gh

Va lu eS

ys t

em s

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

14

Intelligent systems: Moore's Law and Morethan-Moore combined

Processor Storage

Radio

Power

Sensor Actuator

Moore's Law More than Moore

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

15

Not only IC technology, also packaging and assembly are going beyond visualization!
Wire diameter Interconnect pitch of Wafer Level Packaging Thickness of copper film/PCB Microvia diameter Wafer thickness < 10 microns < 20 microns < 5 microns < 20 microns < 20 microns

Advanced packaging: key enabler governing the multi-functional performance, interfaces, size, cost, and reliability of multi-technology products
�-controller PN532 3D passive RF 3DCS RF active P5CN072

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

16

Evolution in assembly & packaging
RF-ID tag QFN Flexible Silicon

Package Diversity

Stacked die Flex Carrier CSP Flip Chip SSOP SO MCM SOT TO DIP DBS QFP BGA Lab-on-a-Chip LED lamp

HTQFP L/TBGA

Camera Modules
Source: Thesis Willem van Driel, NXP, 2007

1965

1970

1975

1980

1985

1990

2000

2010

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

17

Evolution towards microsystems
Diversity
+ Biological domain + Chemical domain

SiP

chip -on-a- ) Lab S (�TA logy echno tem T ro-Sys Mic S MEM

+ Mechanical domain
ctronics Microele

Transistor

IC

SoC
1970 1980 1990 2000 2010

1960

Mechanical, chemical and biological domain entering...
2009 VLSI-TSA Symposium
Ren� Penning de Vries, NXP Semiconductors

18

Outline
Trends in society Trends in technology Solutions Conclusions

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

19

Examples of More-than-Moore solutions
PC Power Supplies Innovations in Lighting Intelligent car key Cold-chain - food control MEMS Oscillator Ultra Low Power devices
2009 VLSI-TSA Symposium
Ren� Penning de Vries, NXP Semiconductors

20

Examples of More-than-Moore solutions
PC Power Supplies Innovations in Lighting Intelligent car key Cold-chain - food control MEMS Oscillator Ultra Low Power devices
2009 VLSI-TSA Symposium
Ren� Penning de Vries, NXP Semiconductors

21

Energy consumption in consumer electronics

!

Energy consumption in on-mode of consumer and computing equipment is magnitudes bigger than in standby mode

Ratio on/standby power consumption
(KWh/Y)

on standby

525 245 88 10.5
PC Desktop

5.2
Notebook TV

2.2

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

22

Energy Star impact on efficiency of computer power supplies

80+

Climate savers computing.org

85 peak 85+ 90 peak 90+?
2007 2008 2009 2010 2011

dynamic power
2009 VLSI-TSA Symposium
Ren� Penning de Vries, NXP Semiconductors

23

GreenChip � Breakthrough in PC power
100%

80%

~100W
Efficiency 60% Save power in operation modes that are used most often by the average PC user
er av S ai Em ss ce Ac

40%

GreenChip PC
g in m a AD /C

20%
en re Sc

eb /W l

G

Target, efficiency 80% and higher Conventional concepts

0W Power Loading
2009 VLSI-TSA Symposium

400W+

Ren� Penning de Vries, NXP Semiconductors

24

Computer Power Supply
Power Factor Correction (PFC) Controller

Synchronous Rectification, Housekeeping and Standby control

Active Reset Forward topology

LV MOS FET's

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

25

Power supply evolution
1) Rethinking of the Traditional Topology 2) Des-integration i.s.o. Integration

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

26

GreenChips make difference

Today: 400M GreenChips in PCs, laptops and TVs!

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

27

Examples of More-than-Moore solutions
PC Power Supplies Innovations in Lighting Intelligent car key Cold-chain - food control MEMS Oscillator Ultra Low Power devices
2009 VLSI-TSA Symposium
Ren� Penning de Vries, NXP Semiconductors

28

Earth at night

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

29

Common light sources

incandescent
2009 VLSI-TSA Symposium

fluorescent

compact fluorescent

light emitting Diode (LED)
30

Ren� Penning de Vries, NXP Semiconductors

Phase-out of Edison's invention
Bans on incandescent lighting
USA Canada UK Italy Argentina Switzerland Ireland Brazil

2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014

Compact Fluorescent Lamp (CFL)

Illustration from U.S. Patent #223898: Electric-Lamp. Issued January 27, 1880 to Thomas Edison
2009 VLSI-TSA Symposium

burner

ballast

base
31

Ren� Penning de Vries, NXP Semiconductors

Electronic Ballasts for CFL: Challenges
Ignition is everything to meet lamp life requirements
Filament erosion temperature dependent

CFL lamp life 5,000-10,000 h Severe reliability requirements on electronics
Base up and in closed fixture

Slide frequency towards resonance Control proper filament preheating and quick and full ignition Frequency controls power and light output

~
2009 VLSI-TSA Symposium
Ren� Penning de Vries, NXP Semiconductors

32

CFL Driver IC in HV SOI technology

Drivers optimized for cost and reliability

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

33

LED: Semiconductors in the solid-statelighting value chain
Level 0 Level 1 Level 2 Level 3 Level 4 Level 5

Wafers / dies

Packaged LEDs

LED arrays on board incl. connects

Modules, incl. Luminaires / driver, controls, fixtures secondary optics

Systems consisting of many luminaires, overall controls

LED driver & control modules Semiconductors Power modules
2009 VLSI-TSA Symposium
Ren� Penning de Vries, NXP Semiconductors

34

LED lighting: the future, but when?
160

LED luminous efficacy is projected to exceed 150 lm/W, Lifetime >30,000 hours Colour temperature and cost are inhibiting rapid introduction

140 120 luminous efficacy (lm/W) 100 80 60 40 20 0 incandescent CFL LED

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

35

Examples of More-than-Moore solutions
PC Power Supplies Innovations in Lighting Intelligent car key Cold-chain - food control MEMS Oscillator Ultra Low Power devices
2009 VLSI-TSA Symposium
Ren� Penning de Vries, NXP Semiconductors

36

What's this?

Your future car key!
2009 VLSI-TSA Symposium
Ren� Penning de Vries, NXP Semiconductors

37

Car key innovation
Yesterday:
Open and close the car by hand No electronic components

Today: Remote Keyless Entry is a standard
Unlocks the car Activate your preferences like seat position, mirror settings, temperature, etc

Tomorrow...?

?
Ren� Penning de Vries, NXP Semiconductors

2009 VLSI-TSA Symposium

38

The connected car key
2-Way communication
Did I lock my car? Feedback from the vehicle, visible on the key
Secure IMMO interface

Connect to other devices & content
Where did I park my car ?
Position sensed by Navigation System and stored in the key 64� 6' 34" ; NXP Road 101 ISO 14443

NFC enabled phone: Displays where I parked my car

Solution involves: Two-Way RF communication Notification in case of theft alarm Increased system security against eavesdropping and replay

ISO 14443

PDA/GSM with NFC and GPS
2009 VLSI-TSA Symposium
Ren� Penning de Vries, NXP Semiconductors

39

Examples of More-than-Moore solutions
PC Power Supplies Innovations in Lighting Intelligent car key Cold-chain - food control MEMS Oscillator Ultra Low Power devices
2009 VLSI-TSA Symposium
Ren� Penning de Vries, NXP Semiconductors

40

Perishable Food
Global waste of perishable products: 35 B$ per year
Food, Drinks, Flowers, Pharmaceuticals, Vaccines, Blood, Chemicals, Film Lack of low-cost (sub-1$) monitoring equipment

Sensors: Temperature, humidity, pH, Ethylene, O2, CO2, Light intensity Sensors are integrated in smart tags, that is: RF-ID chips

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

41

Food safety & health care, by smart tagging
Dynamic monitoring of food, medication etc throughout supply chain
T P
pH
Chemical/Biological

Physical sensing

Contains:
- Memory to store data - Signal processor for robust measurements and fast data transfer - Paper-thin environmentallyfriendly battery

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

42

Examples of More-than-Moore solutions
PC Power Supplies Innovations in Lighting Intelligent car key Cold-chain - food control MEMS Oscillator Ultra Low Power devices
2009 VLSI-TSA Symposium
Ren� Penning de Vries, NXP Semiconductors

43

The hidden market of timing devices
EVERY piece of electronics requires a timing device...

Some timing applications:
Wired and wireless communication Analogue-Digital converters Clocking digital circuits Generic time tracking

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

44

What is a MEMS oscillator?
MEMS based oscillator
MEMS resonator

resonator amplifier Key parameters: -Accuracy -Noise -Power consumption -Size -Price
Ren� Penning de Vries, NXP Semiconductors

accurate clock signal

CMOS amplifier
2009 VLSI-TSA Symposium

45

On-wafer packaged resonator with high-Q

Q~100,000 @26MHz

High Yield on Low-Pressure cavities
100000

Q-factor

10000

1000

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 63 65 67 69 71 73 75 77 79 device index [-]

h Hig

d! iel y
Pressure maintained in cavity is 100,000 devices

15 MHz quartz resonator 2.5X2.0X0.55 mm3

Cheap

Small

quartz

Scalable

min. product height: 400 um +/-10%

product height: 10% MEMS-XO TAM=80-200M$
2009 VLSI-TSA Symposium
Ren� Penning de Vries, NXP Semiconductors

48

Examples of More-than-Moore solutions
PC Power Supplies Innovations in Lighting Intelligent car key Cold-chain - food control MEMS Oscillator Ultra Low Power devices
2009 VLSI-TSA Symposium
Ren� Penning de Vries, NXP Semiconductors

49

Ultra Low Power Technology
Low Power DSP (Coolflux)

� � � �

Small, ULP programmable core Highly optimizing C compiler Several design-ins 45 W/MHz @ 0.9V in 130nm CMOS 25 W/MHz @ 0.9V in 65nm CMOS

Magnetic Induction Radio

� � �

Magnetic Induction: body tissue friendly! 149 � 298 kbps, 7.5 � 15 MHz band Ex. 298kbps, bidir., @ 25cm, 2.9 mA

2009 VLSI-TSA Symposium

Ren� Penning de Vries, NXP Semiconductors

50

Ultra Low Power Solutions
For the medical domain
"Hearing Aid" ... a running healthy business!
Subscribe
x