Automated CD-SEM operations for TD & MFG

Automated CD-SEM operations for TD & MFG

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Author: Alexander Starikov (Fellow) | Visits: 1582 | Page Views: 1598
Domain:  High Tech Category: Semiconductors Subcategory: Reverse Engineering 
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Contents:
Automated CD-SEM Operation for Efficient HVM
Alexander Starikov California Technology & Manufacturing Intel Corporation Santa Clara, CA 10/24/2007

Metrology Use Models
TD/Engineering
Characterization
Low WIP Dense sampling Flexible, interactive

Manufacturing
Process control
High WIP Capable but sparse Fixed, controlled

Accelerated learning
Process evaluation Variance segmentation and reduction Validation of process control
2

Efficient production
Excursion prevention Portability and matching

Engineering Challenge: CD Control
Issue: CD variation X-wafer, X-lot, lot-lot Process variables: DOSE and FOCUS

3

Segmenting CD Variation
One lot, from "cold"
MEAN slot CD in process sequence
81

What drives CD variation?
Correlation of CD to effective DOSE
81

M A TA G nm E N R ;

80 79 78

3 = 3.3nm
M E A N s lo t C D /n m

77 76 75 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25

80 79 78 77 76 75 22.5

y = 8.10x - 106.54 R2 = 0.81

Slot order at exposure

estDOSE(LEMSout30^2) in slot order
23.5

M A est. D S /m E N O E J

23.2

3 = 0.36mJ

22.9

22.6

22.7

22.8

22.9

23.0

23.1

23.2

22.6

MEAN estimated effective DOSE/mJ
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25

22.3

Slot order at exposure
estFOCUS(MIS&L_10&30) in slot order
75

MA e t F C S m E N s. O U / u

50

3 = 11nm

25

0

DOSE-like effects: � Bake temperature � Delay to bake �...

-25 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25

Slot order at exposure

4

Reducing CD Variance
Slot to slot
MEAN slot CD in process order
82 81 80

Next

Module=1 Contour Plot for DCCD TARG/nm
Legend 6 DCCD TARG/nm 5 Y field 4 3 2 1 -1 0 1 2 3 4 5 6 7 8 9 10
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