CMOS MEMS/BioMEMS Design Platform for Sensor IP and System

CMOS MEMS/BioMEMS Design Platform for Sensor IP and System

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Description: Smart Life with Wireless Sensor Chip, CMOS MEMS/BioMEMS Design Platform, Reference Designs, Application Trend of Chips, Wireless Sensing Network, Wireless Sensor Chips, Smart Life, Smart Sensor Chip Design Platform, MEMS Module Design Flow, Material Properties, Behavior Model Extractions, Generic Sensor Readout Architecture, CMOS MEMS Process, CMOS BioMEMS Process, CIC CMOS MEMS/BioMEMS Process, CMOS Sensor IP Package Platform, Microfluidics in CMOS BioMEMS, CMOS MEMS Measurement Service.

 
Author: Dr. Chin-Fong Chiu (Fellow) | Visits: 3043 | Page Views: 3691
Domain:  High Tech Category: Semiconductors Subcategory: MEMs 
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Contents:
CMOS MEMS/BioMEMS Design Platform for Sensor IP and System
Dr. Chin-Fong Chiu
Deputy Director General National Chip Implementation Center(CIC) National Applied Research Laboratories(NARL)

2010/9/9

1

Outline

The Smart Life with Wireless Sensor Chip CMOS MEMS/BioMEMS Design Platform Reference Designs Summary

2
2

Application Trend of Chips
Computer
(Data)

Communication
(Wireless network)

Sensing
(sensor) Wii

Wireless LAN IBM system Mobile phone

Notebook Apple II 1980 1990 2000
3

Source: web sites

2010

Wireless Sensing Network
� Living better by wireless sensing network

Source: web sites
4

Wireless Sensor Chips
To provide the real-time health screening and upgrade life quality, the platforms aim at converting the biomedical or environmental information into silicon chips on which the information is further integrated by the circuits.
DNA Protein Cells...

Heterogeneous integration & Minimization

Sources: www.intel.com; www.imec.be

Temperature Humidity Gases...

Data Transmission
5

The Smart Life in the Future

6

The Smart Life
Integrating with daily necessities or accessories such as toothbrushes, necklaces, ornaments, etc., the sensors can detect our physical and environmental status, and suggestions can further be provided for better life.

The outdoor sensor detects that the UV index is high and applying the sunscreen with high sun protection factor is suggested.
7

The sensor on the necklace detects that the skin pH is balanced.

The sensor on the toothbrush detects that the gum is inflamed and seeing a dentist is suggested.

How It Work for Smart Life
A smarter life can be realized by developing various wireless biomedical /environmental sensor chips, and applying available wireless networks as well as data processing centers.
The hospital's data centers process all of the information & provide Wireless Hub at Homesuggestions for daily life.

Sensor in Toothbrush

Suggestions will be shown on the surface of appliances.

8

Sensor in Necklace

Environmental Sensors

Smart Sensor Chip Design Platform

9

Outline

The Smart Life with Wireless Sensor Chip CMOS MEMS/BioMEMS Design Platform Reference Designs Summary

10
10

CMOS MEMS/BioMEMS Design Platform
Sensor IP (SoC) spec.

Design Platform

Redesign?

Measurement Platform

Package Platform

Process Platform

11

CMOS MEMS/BioMEMS Design Platform
Full-Custom/Cell-Base/RF IC circuits Sensor IP (SoC) spec. Co- Simulation
(Cadence; Hspice; Coventor)

IC Design Flow MEMS Module Design Flow
MEMS Sensor & Actuator
(Structure)

3D model generation

Material Parameter Modifications
(Young's Modulus, Stress)

Device Behavior Simulation

Macromodel Extraction (Verilog A)

Layout

Redesign?

Design Platform

Measurement Platform

Package Platform

Process Platform

12

Material Properties
Completed 0.35m/0.18m material properties extraction (stress gradient, inplane stress, Young's modulus) to understand the effects of CMOS layers (poly, metal, oxide..etc.) by using test keys. Investigate the design insight by considering the material properties in real sensor design.
Stress gradient(for 500 �m cantiliever)
80.00 70.00 60.00 50.00 40.00 30.00 20.00 10.00 0.00 -10.00 -20.00 -30.00 -40.00 -50.00
Average MAX MIN

�m

1

2

3

4

5

6

7

8

9

10

11

12


13

Behavior Model Extractions
Static Force Equilibrium

Mass Damper Vdc Spring
Electro-Static Force
Extract the macromodel from FEM simulation

Damper

Electro-Static Force

Mass

Spring

Coventor / Architect Mechanic Behavior Models Specified Case (Mast)

Cadence(Spectre) Hspice Spring Damper Mass (Verilog-A) Foundry Supported

Circuits Model
14

Simplified Model

Verilog-A

Generic Sensor Readout Architecture
Customization

Peripherals Circuit:
Embedded Impedance Bridge Low-Noise Pre-Amplifying High-Dynamic Range Sigma-Delta ADC Adaptive Calibration/Control Logic Bandgap Reference LDO PLL ...

15

CMOS MEMS/BioMEMS Design Platform
Full-Custom/Cell-Base/RF IC circuits Sensor IP (SoC) spec. Co- Simulation
(Cadence; Hspice; Coventor)

IC Design Flow MEMS Module Design Flow
MEMS Sensor & Actuator
(Structure)

3D model generation

Material Parameter Modifications
(Young's Modulus, Stress)

Device Behavior Simulation

Macromodel Extraction (Verilog A)

Layout

Redesign?

Design Platform

Measurement Platform

Package Platform

Post MEMS Process Process

Platform Foundry

CMOS

16

CMOS MEMS Process

3D Inductor
17

Ring Resonator

Cantilever Beam

CMOS BioMEMS Process
Based on current CIC 0.35um MEMS process to add gold layer (3KA) for molecular adsorption. Gold is on the top of the structure. It can be above passivation or AlCu.
Gold- plate Au Au AlCu AlCu
25um 25um

Cantilever or released structure Au AlCu Oxide Au AlCu

AlCu

Silicon substrate

18

CIC CMOS MEMS/BioMEMS Process
CMOS Process: TSMC CMOS Post-Process at APM to release the MEMS designs 0.35�m 2P4M CMOS MEMS process (from 2002) (5 runs/year) 0.18�m 1P6M CMOS MEMS process (from 2006) (4 runs/year) 0.35�m 2P4M CMOS BioMEMS process (from 2009) (2 runs/year)
Design kits on Cadence, Mentor, CoventorWare
Techfiles (Cadence, Laker) Design Rule Check files (Calibre) Design Handbook Process descriptions for simulation tool (Coventor) RF MEMS inductor layout and model files (ADS, Cadence) Effective Young's modulus, stress, stress gradient database (6 runs in 0.35 m, 4 runs in 0.18 m CMOS MEMS)
19

CMOS MEMS/BioMEMS Design Platform
Full-Custom/Cell-Base/RF IC circuits Sensor IP (SoC) spec. Co- Simulation
(Cadence; Hspice; Coventor)

IC Design Flow MEMS Module Design Flow
MEMS Sensor & Actuator
(Structure)

3D model generation

Material Parameter Modifications
(Young's Modulus, Stress)

Device Behavior Simulation

Macromodel Extraction (Verilog A)

Layout

Redesign?

Design Platform
Die-level
(PR/dicing/cleaning/bonding) Post MEMS Process CMOS Foundry

Measurement Platform

Package Platform (on-wafer measure)
Biochip Isolation Technology

Wafer-level

Process Platform
20

CMOS Sensor IP Package Platform
Die Level Wafer Level

PR coating and dicing

After cleaning

Wafer Level
Designer A Designer B a cc c c b cc d e c c c f Designer C

Chip C Chip A Chip B

Microfluidics in CMOS BioMEMS
Collaborate with ITRC and NCHC to setup a microfluidics system Biomedical sample to sensor area by using capillary force

Inlet Inlet Outlet Microfluidic

Outlet Sensing area chip

CMOS MEMS Measurement Service
White light Interferometer MMA (MEMS Motion Ananlzer) Laser Doppler Vibrometer 3-axis accelerometer measurement environment

shaker
23

CMOS BioMEMS Measurement Environment Setup

Electronic Balance

Clean Bench

Biomedical Freezer

Drying Oven

CMOS BioMEMS Measurement Environment Setup

Stirrer

pH meter

O2 plasma

Desiccator

Micro jet

Engraving machine

CMOS MEMS Chips Statistics
160 140

Total CMOS MEMS Chips Sensots & Actuators RF MEMS

CIC CMOS MEMS chip amounts

120 100 80 60 40 20 0 2003

2004

2005

2006

2007

2008

2009

Year
26

Outline

The Smart Life with Wireless Sensor Chip CMOS MEMS/BioMEMS Design Platform Reference Designs Summary

27
27

Reference Designs

Accelerometer

Thermal Sensor Environment Sensing CMOS MO-MEMS Platform

Tactile Sensor

RF Library

RF

MEMS VCO

Protein A/IgG ELISA
Gap:5um Gap:10um Gap:15um

Bio Sensing ISFET/Creatinine Flow Sensor MEMS Switch

Sensing Reference area

28

Resonator

0.35m CMOS MEMS Accelerometer

0.2 �m curling with poly-silicon 6-8 �m curling with stress gradient
Reset
VBP VBP

Reset

OUT1 OUT2
PLS1 PLS2

Vx1
VBN

Vx2

VBN

CMOS MEMS Accelerometer

Proof Mass, Comb, and Spring

Ref=1.65 V Enable / Disable Enable / Disable

Counter
15-Bit

CK Up / Down

Counter
10-Bit

PWM_Out1

Digital Pulse Width Modulator

PWM_Out2

Circuits for accelerometer
29

Shaker

Chip on PCB

0.35m CMOS MEMS Accelerometer

Specifications size Prof-mass Spring Constant Natural frequency Capacitor gap Sensing Cap Cap Sensitivity Sensitivity
30

0.35 m CIC CMOS MEMS Accelerometer 430m*330m 0.77mg 0.6N/m 4.44kHz 2m < 25fF x 4 0.585fF/g 0.62mV/g

Thermal Sensor
Seebeck Effect
(IEEE Sensors 2008)

V = N

CMOS MEMS Thermal sensor

Measured temp. distribution
31

Sensing circuits

Oscillating frequency output vs. maximum heater temperature

Reference Designs (Environmental or Motion)

(IEEE J. Microelectromechanical Systems '06)

Tactile Sensor w/i ckt

Thermal Sensor w/i ckt
(IEEE sensor '08)

Resonator
(MNE '09)

Accelerometer(1 axis)

Accelerometer (1 axis) w/I ckt
(13th Nano and Microsystem Technology Conference '09)

Accelerometer (x, y axis)

Accelerometer (z axis)

Reference Designs

RF Library Accelerometer Thermal Sensor Environment Sensing CMOS MO-MEMS Platform Protein A/IgG ELISA
Gap:5um Gap:10um
33

Tactile Sensor

MEMS VCO RF

Bio Sensing ISFET/Creatinine Flow Sensor MEMS Switch

Sensing Reference area

Gap:15um

Resonator

CMOS MEMS VCO & Inductors
Sensors and Actuators A. physical, 2007

88%

0.18 �m CMOS MEMS process (CIC)

Q improves 88%

The model of CMOS MEMS inductor

CMOS MEMS VCO

CIC CMOS MEMS inductor library
34

Better phase noise

Reference Designs (RF)

RF Library

MEMS Switch

Resonator

MEMS VCO
(Sensors & Actuators, '07)

MEMS Switch

Resonator

Reference Designs

RF Library Accelerometer Thermal Sensor Environment Sensing CMOS MO-MEMS Platform Protein A/IgG ELISA
Gap:5um Gap:10um
36

Tactile Sensor

MEMS VCO RF

Bio Sensing ISFET/Creatinine Flow Sensor MEMS Switch

Sensing Reference area

Gap:15um

Resonator

Cantilever � Piezoresistance
(IEEE sensor Journal 2009)

Breath monitor for new-born baby Alarm after baby stop to breath 5 secs.
Cantilever with circuit

Flow Rate (m/s)
37

Using Gold Nanoparticles for Immunoassay
(APCOT 2008, Eurosensors 2008)

Fast Detect Protein A
Gap:5um

Gap:10um

narrower electrode gap to 5�m Detection time is about 14 mins
Antigen Protein A

Gap:15um

Au Nanoparticles Ag+

Conduct
Antibody IgG
38

pH Value Detection by ISFET
(Eurosensors 2009)

� Use native oxide on the top of AlCu as the sensing layer to detect pH value

(1) Temperature sensor, (2) High resolution pH meter, (3) Reference electrode,
39

ISFET chip

(4) ISFET chip

Protein Detection by ISFET
(Sensors and Actuators B, 2009) Bio markerCreatinine Membrane MIP (Molecularly Imprinted Polymer) TransducerISFET (Ion Selective Field Effect Transistor)

MIP

Sensing area Reference Circuit 500m
Ref. electrode

Intel� BioElectronic Chip (ISFET to detect PSA)

ISFET chip

Sensing area Reference 500m
40

Assembly of disposable chip and interconnection

DNA Detection by Cantilever
NTU/Prof. CTLin

Before Drop Probe DNA

After Drop Target DNA

Resonant Sensor
NME 2009

Resolution: 3.46*10^-9mg /Hz

CMOS BioMEMS Sensor Designs
Bio target pH DNA Transducer type Electrode
Gap:5um Gap:10um Gap:15um
Sensing area
Reference

Protein

Antibody/Antigen Cantilever

FET

IgG/protein A
(APCOT 08 Sensors & Actuators B '10)

pH; Creatinine
(Eurosensor '08,'09)

Static cantilever

Flow Sensor
(IEEE Sensor Journal '10)

Resonant Sensor
(NME '09)

Bio Sensors
DNA hybridization study Baby breath monitor pH value Gas monitor Immunoassay sensor

liver kidney
Ref. electrode

ISFET chip

Bilirubin Lysozyme Creatinine Albumin urea
verified under verifying under developing

44

Outline

The Smart Life with Wireless Sensor Chip CMOS MEMS/BioMEMS Design Platform Reference Designs Summary

45
45

Summary
CIC Wireless sensing platform includes 0.18/0.35um CMOS MEMS/BioMEMS process Verified sensor/biosensor reference designs Isolation techniques in liquid environment Bio preparation and test environment RF design and measurement SiP technology

Summary
Design and realize micro-sensing system in CIC CMOS MO-MEMS and SiP platform
ADC DSP Sensor control ASIC Memory DAC

RF frontend

Sensor IP
R V I C T

CPU

SoC

SiP

Micro-sensing system

47

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