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Description: 3D Chip Stacking Technology Chip stack WB FC WB type 1998 FC type 2006 Mobile phones, digital cameras, image processing devices Package stack WB PoP Used with chip stacking 2002 Digital cameras, mobile phones TSV chip stack TSV: Through Si Via 2010 and later ~ High-end devices High-speed image processing devices Wireless chip stack Source: Sharp, Tohoku University Author: Morihiro Kada, ASET
Upload Date: 26-Apr-2010
View Count: 805
Reference URL: http://electronics.wesrch.com/paper_details/pdf/EL1SE1000OLDR/3d-integrated-circuit-technology
Short URL: http://www.wesrch.com/wiki1269
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