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3D Chip Stacking Technology Classification

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Description: 3D Chip Stacking Technology Chip stack WB FC WB type 1998 FC type 2006 Mobile phones, digital cameras, image processing devices Package stack WB PoP Used with chip stacking 2002 Digital cameras, mobile phones TSV chip stack TSV: Through Si Via 2010 and later ~ High-end devices High-speed image processing devices Wireless chip stack Source: Sharp, Tohoku University Author: Morihiro Kada, ASET

Upload Date: 26-Apr-2010

View Count: 1426

Reference URL: http://electronics.wesrch.com/paper_details/pdf/EL1SE1000OLDR/3d-integ

Short URL: http://www.wesrch.com/wiki1269

3D Chip Stacking Technology Classification

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