Home»

3D Chip Stacking Technology Classification - free slide submission, upload slide - weSRCH

3D Chip Stacking Technology Classification

Share  Email

Description: 3D Chip Stacking Technology Chip stack WB FC WB type 1998 FC type 2006 Mobile phones, digital cameras, image processing devices Package stack WB PoP Used with chip stacking 2002 Digital cameras, mobile phones TSV chip stack TSV: Through Si Via 2010 and later ~ High-end devices High-speed image processing devices Wireless chip stack Source: Sharp, Tohoku University Author: Morihiro Kada, ASET

Upload Date: 26-Apr-2010

View Count: 1169

Reference URL: http://electronics.wesrch.com/paper_details/pdf/EL1SE1000OLDR/3d-integ
rated-circuit-technology

Short URL: http://www.wesrch.com/wiki1269

3D Chip Stacking Technology Classification

<< Back

CC Creative Commons - Free to Use with Attribution

« Venture Capital Investment Basics 3D Packaging Design Environment Technology »

Recent Slides :


  • Connect With Us
    To creat a knowledge base, To bridge between science and realities in public administration.
  • Installed Immunoassay Base in the World
    28,000 system installed in the world: A menu with 100 clinical parameters.
  • Unexpected Benefits of Flash
    Storage Availability: 100% storage availability over the past 18months, Zero drive failures.
  • Full Speed Innovation
    Controlling our own density, Innovation, Advanced feature, More Features, Empowerment, Re-Use, faster development, Cost Impro... more
  • Unfairness
    Element 1: Substantial injury, Element 2: Injury not reasonably avoided, Element 3: Not outweighed by countervailing benefits... more
 
Subscribe
x