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Description: 3D Chip Stacking Technology
Chip stack WB FC
WB type 1998
FC type 2006
image processing devices
Package stack WB PoP
Used with chip
TSV chip stack TSV: Through Si Via
2010 and later ~
Wireless chip stack
Source: Sharp, Tohoku University
Author: Morihiro Kada, ASET
Upload Date: 26-Apr-2010
View Count: 805
To view posted image, you must login first
CC Creative Commons - Free to Use with Attribution
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