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3D Packaging Design Environment Technology

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Description: R&D on High Speed Circuitry Simulation Engine R&D on High Speed Electromagnetic Field Simulation Engine R&D on Integrating High Speed Electric Circuitry and Electromagnetic Field Simulation Engine Electromagnetic Field Simulator -Use combination of FDTD method and parallel computation Result: 120times increase in speed Circuitry Simulator - Develop new calculation algorithms - Use parallel computation Result: 240times increase in speed Circuit Equivalent to the System Direct Integration Prospect increased precision by integrating electromagnetic field analysis and circuit analysis FDTD:Finite Difference Time Domain Board Configuration of Recent Digital Appliances PWB SOC High-Speed Memory SiP substrate NAND Flash TSV (Through Si Via) Analog Memory bus 200MHz 1GHz Digital (Low speed) Board High-speed memory RF-IC (SDRAM) Logic Digital (2.5Gbps) Cross-section of SiP part Author: Morihiro Kada, ASET

Upload Date: 26-Apr-2010

View Count: 1403

Reference URL: http://electronics.wesrch.com/paper_details/pdf/EL1SE1000OLDR/3d-integ

Short URL: http://www.wesrch.com/wiki1270

3D Packaging Design Environment Technology

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