Go to Page # Page of 26

Assembly and Packaging 2007 Roadmap

Views: 1971
Domain: Electronics
Category: Semiconductors
ITRS Assembly and Packaging 2007 Roadmap

Progress is exceeding Roadmap Forecast
3D packaging

Techniques for 3D packaging are proliferating

Flexible/wearable electronics Wafer thinning Wafer level packaging System level integration in Package

Major Challenges
Handling for ultrathin die Cost targets for new package types Co-Design tools for SiP, 3D packaging, TSV, etc. Handling in ... See more

Recent Presentations

21 August, 2019

Smart City Construction By Digital Brain

Here Digital Brain promoting smart city construction with the new interpretation of policies. Also, build a people-oriented smart society like livable and business-friendly.

Eric Sun
20 August, 2019
19 August, 2019