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Assembly and Packaging 2007 Roadmap

 ITRS
  8th-Oct-2007
Views: 1971
Domain: Electronics
Category: Semiconductors
Contents:
ITRS Assembly and Packaging 2007 Roadmap

Progress is exceeding Roadmap Forecast
3D packaging

Techniques for 3D packaging are proliferating

Flexible/wearable electronics Wafer thinning Wafer level packaging System level integration in Package

Major Challenges
Handling for ultrathin die Cost targets for new package types Co-Design tools for SiP, 3D packaging, TSV, etc. Handling in ... See more

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