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Chemical Mechanical Planarization Damascene Process

 Muhammad Khan and Min Sung Kim
  29th-Nov-2011
Description: Chemical Mechanical Planarization Damascene Process, CMP Damascene - Traditionally, IC interconnects formed from Aluminum, Interconnects produced by subtractive etching of blanket Aluminum, defined by the photoresist pattern, Over the past two decades, IC scaling and performance needs necessitated the change in metal from Aluminum to Copper. Transition from Aluminum to Copper, Challenges with Copper and Solution. Damascene Process, Damascene Process Steps and other information.
Views: 5257
Contents:
Damascene Process and Chemical Mechanical Planarization
Muhammad Khan Min Sung Kim

Background
Traditionally, IC interconnects formed from Aluminum Interconnects produced by subtractive etching of blanket

Aluminum, defined by the photoresist pattern Over the past two decades, IC scaling and performance needs necessitated the change in metal from Aluminum to Copper

Transition from Aluminum t ... See more

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