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Embedded Thermoelectrics: chip cooling for enhanced reliability and thermal performance

 Nextreme
  4th-Feb-2008
Views: 1865
Domain: Electronics
Category: Semiconductors
Contents:
4/30/2007
Nextreme Thermal Solutions 3040 Cornwallis Rd Research Triangle Park NC 27709 Phone 919 541 6237 Fax 919 485 2600

Embedded Thermoelectrics
Hot spot or whole chip cooling of FPGA devices for enhanced reliability and thermal performance

Nextreme Thermal Solutions April 28, 2007

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THIN FILM THERMOELECTRIC � WHITE PAPER 07-NTSI001

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