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Enabling Improved Semiconductor Performance Without Sacrificing Efficiency

 Dr. Paul Magill
  9th-Jan-2008
Views: 2258
Domain: Electronics
Category: Semiconductors
Contents:
Nextreme Thermal Solutions 3040 Cornwallis Rd Research Triangle Park NC 27709

Phone 919 541 6237 Fax 919 485 2600

The Thermal Copper Pillar Bump
Enabling improved semiconductor performance without sacrificing efficiency

Nextreme Thermal Solutions January 9, 2008

1

Executive Summary
Active cooling of any device is most efficient when it occurs closest to the source of heat generation. All adv ... See more
Dr. Paul Magill
09 January, 2008