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Evolution Of 200mm For The Internet Of Everything

 Tim Tobin
  8th-Nov-2015
Description: All Things CMP: World’s Largest CMP Technology Portfolio-CMOS: Oxide, Tungsten, Copper, Barrier Metals(Ta,Co,Ru), Shallow Trench, Polysilicon, Low k Dielectrics, Capped Ultra Low k, Metal Gates, Gate Insulators, High k Dielectrics, Ir & Pt Electrodes, Refractory Metals, Aluminum; New Apps: MEMS, Through Si Vias (TSV), Direct Wafer Bond, 3D Packaging, Ultra Thin Wafers, Polymers & Resists, CNT & Nanodevices, NiFe & NiFeCo, Al & Stainless Steel, Detector Arrays, Magnetics, Photonics & Solar, LED & Optics, Power Devices, Analog & RF, FINFET Structures; Substrate/Epi: Si and SOI, GaAs & AlGaAs, InP & InGaP, poly-AlN & GaN, CdTe & HgCdTe, Ge & SiGe, Lithium Niobate, Titanium, Quartz & Glass, Sapphire, Diamond & DLC, SiC; Polishers: AMAT: Mirra & Reflexion Platforms, IPEC: Rotational (3/4) & Orbital (6/7) Platforms, SpeedFam: Auriga (C & EC), Ebara: EPO & F-REX Platforms, Strasbaugh: 6EC, 6DS-SP, 6EG; Cleaners: OnTrak: DSS-200 Series 0, 1, 2, Synergy & Integra, AMAT: Mesa, Desica (Trak & DNS); Metrology: Film Thickness: Rudolph, Therma-Wave, CDE, Foundry: CMP, SEZ & Lapping, All wafer sizes, Process development, Materials screening, Cost reduction, Volume production.
Views: 1479
Domain: Electronics
Category: Semiconductors
Contributing Organization: SEMI
 ‐ More of their Presentations
SEMICONDUCTOR ANALYTICS
Contents:
“Evolution of 200mm for the Internet of Everything”
SEMICON WEST 2015
July 15, 2015

Semiconductor Equipment

Spare Parts and Service

Entrepix Confidential Information

CMP Foundry

All Things CMP
World’s Largest CMP Technology Portfolio:
CMOS

New Apps

Substrate/Epi

Oxide

MEMS

Si and SOI

Tungsten

Through Si Vias (TSV)
Direct Wafer Bond

poly-AlN & GaN

Ultra Thin Wafers
... See more

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