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Free Air Ball Modeling for Gold Wire Bonding for Different Wire Diameters

 Yee Chen Tan, Boon Hoe Toh, Hong Meng Ho and Jonathan Tan
  23rd-Jul-2007
Views: 3831
Domain: Electronics
Category: Semiconductors
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Contents:
Free Air Ball Modeling for Gold Wire Bonding for Different Wire Diameters
Yee Chen Tan*, Boon Hoe Toh, Hong Meng Ho and Jonathan Tan Kulicke & Soffa Pte. Ltd * 6, Serangoon North Ave 5, #03-16, Singapore 554910 Phone: +65-6880-9313, Fax: +65-6880-9488 and Email: yctan@kns.com Abstract Thermosonic wire bonding cycle begins with the formation of a Free Air Ball (FAB), which is pressed onto an Integr ... See more

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