Prev

IBM's 32nm Hi-K Chip Technology: An interview with Gary Patton

 Dr. Gary Patton     IBM
  3041      Apr 29, 2008
IBM’s 32nm Hi-K Chip Technology: An interview with Gary Patton, Vice President of the Semiconductor Research  and Development Center of IBM’s Systems and Technology Group, on the business tactics behind their implementation of Hi-K strained silicon, Air Gap, & eDRAM as well as their strategy of reducing design costs for 32nm. Find out why some companies are skipping nodes and how they are able to do it.
About weVISION: weVISION is a series of video interviews of visionaries by G Dan Hutcheson, his career spans more than thirty years, in which he became a well-known as a visionary for helping companies make businesses out of technology. This includes hundreds of successful programs involving product development, positioning, and launch in Semiconductor, Technology, Medicine, Energy, Business, High Tech, Environment, Electronics, healthcare and Business divisions.
Important Tags: Gary Patton eDRAM

You may like this also:

...
24 August, 2019
Andrea Lati
23 August, 2019
...
23 August, 2019
HAB Association
22 August, 2019
...
21 August, 2019

Smart City Construction By Digital Brain

Here Digital Brain promoting smart city construction with the new interpretation of policies. Also, build a people-oriented smart society like livable and business-friendly.

Eric Sun
20 August, 2019
...
19 August, 2019
...
17 August, 2019

Recent weVISIONs

Open IC Design Platforms ... with Michael Wishart of Efabless
Michael WishartEfabless
20 August, 2019
Tom Caulfield on what's next at GLOBALFOUNDRIES
Tom CaulfieldGLOBALFOUNDRIES
22 July, 2019