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Warpage Measurement of PCB With 3D Metrology

 NANOVEA | A Better Measure.
  10th-Jun-2010
Description: Flatness measurement of electronic parts and assemblies, or PCBs, has become increasingly critical as geometries become smaller: finer pitches, smaller solder ball volumes, thinner substrates, etc. Additionally, processing temperatures vary and can play a major role in PCB warpage and or planarity defects. As a result, accurate flatness measurement has become vitally important to warpage characterization and planarity measurement.
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Domain: Electronics
Category: Business
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Contents:
Warpage Measurement of PCB With 3D Metrology

Prepared by Craig Leising
6 Morgan, Ste156, Irvine CA 92618 � P: 949.461.9292 � F: 949.461.9232 � nanovea.com
Today's standard for tomorrow's materials. � 2010 NANOVEA

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