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Leadless Flip Chip PLGA For Networking Applications

 Andrew Mawer, Paul Galles Steve Safai, Trent Uehling
  8th-Aug-2017
Description: Initial SMT assembly trials with 1:1 stencil and only minimal (<10 mm) solder on LGA pads resulted in some outer row solder joint opens. Decision made to provide 100 mm pre-applied solder bumps on the package LGA pads
Views: 805
Domain: Electronics
Category: Semiconductors
Contributing Organization: SMTA
 ‐ More of their Presentations
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Contents:
LEADLESS FLIP CHIP PLGA FOR
NETWORKING APPLICATIONS
Andrew Mawer1, Paul Galles Steve Safai
and Trent Uehling
NXP Semiconductors N.V.
1Email:

andrew.mawer@nxp.com
Phone: +1-512-895-7925

Outline


Motivation



Component Details



Reflow Warpage
PCB Pad Designs





Solder Paste Stencil Design
Solder Reflow Profile



X-Ray Inspection



Board-Level Reli ... See more

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