Status Of The Cmos Image Sensor Industry

Status Of The Cmos Image Sensor Industry

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Description: We are raising our forecast for CMOS Image Sensors Mostly driven by smartphone camera crase and the renewal of applications in the consumer space, CIS market keeps its momentum while passing the $10B landmark The main reason for this forecast increase is the early introduction of dual cameras in smartphones. When Yole Développement presented its first report in 2010, the imaging industry was at a turning point as CMOS image sensor revenues were breaking the 50% threshold in respect to CCD.

 
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Contents:
From
Technologies
to Market

Status of the
CMOS image sensor
industry
2016 report sample

Authors: P. Cambou JL. Jaffard

© 2016

Executive Summary

REPORT OBJECTIVES
Provide a clear understanding of applications and related technologies.
Ecosystem identification and analysis:






Determination of the applications range
Technical market segmentation
Economic requirements by segment
Key players per market and analysis
Market size and market forecast in $M and Munits

Ecosystem

Market

Analysis and description of market and technologies involved:






Major actors on a global basis
Detailed applications per market segment
Technology identification for different products and processes
Competing technologies
Main technical challenges

Techno

©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample

3

METHODOLOGIES & DEFINITIONS
Yole’s market forecast model is based on the following elementary structured blocks:

Yole’s
analysis
framework

©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample

4

WHAT IS TAKEN INTO ACCOUNT BY THE ANALYSIS ?
From wafer to first packaged sensor

Analysis at the
component
level

Courtesy of Xiaomi

Courtesy of Sony

Courtesy of Omnivision

Courtesy of On Semi

Courtesy of Valeo

Wafer

Die

Courtesy of Apple

Sensors

Modules

Courtesy of Tesla

Systems

©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample

5

TABLE OF CONTENT (1/2)
o GOSSARY

2

o TABLE OF CONTENT

3

o REPORT OBJECTIVES

5

o METHODOLOGY

7

o COMPANY CITED

13

o EXECUTIVE SUMMARY

14

1 - INTRODUCTION
• Historical perspective
• Market segmentation
• 2015 CIS market landscape by application
• 2015 CIS market landscape by player

30

2- MARKET FORECAST
39
• Revenue breakdown
• 2010 - 2021 CIS volume shipment (in Munits)
• 2009 - 2020 CIS revenue forecast (in $M)
• 2009 - 2020 Wafer production (in 12”wafer eq.)
• BSI penetration forecast
• 200mm (8”) to 300mm (12”) transition forecast

3- ECOSYSTEM
• Recent consolidation
• M&A activity
• Ecosystem mapping
• Geographic mapping

52

4- PLAYER & RANKINGS
61
• Revenue rankings
• Volume rankings
• Revenue breakdown per player
• Revenue market share in mobile
• Revenue market share in digital photography
• Revenue market share in tablets
• Revenue market share in laptop PC
• Revenue market share in automotive
• Revenue market share in security & surveillance
• Revenue market share in medical X ray
• Revenue market share in machine vision

©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample

6

TABLE OF CONTENT (2/2)
5 – MOBILE MARKET TREND
• Consumer tech device forecast
• 2010 - 2021 Mobile market forecast
• Market drivers
• Resolution mix
• Dual camera trend
• Number of camera per smartphone forecast

78
• 2010 - 2021 Medical CIS market forecast
• 2010 - 2021 Security & surveillance market forecast
• 2010 - 2021 Machine vision market forecast

6- CONSUMER MARKET TREND
101
• 2010 - 2021 Consumer photography market forecast
• 2010 - 2021 Action camera market forecast
• 2010 - 2021 VR & AR market forecast
• 2010 - 2021 Wearable & smartwatch market forecast
• 2010 - 2021 Personal robotics market forecast
7- OTHER MARKET TREND
• 2010 – 2021 Computing market forecast
• 2010 – 2021 Automotive market forecast
• Automotive market drivers

112

8- TECHNOLOGY TREND
• Image sensor specifications
• BSI technologies
• Samsung S7 focus
• PDAF and LDAF approaches
• Key advances

128

9- CONCLUSIONS

152

10- COMPANY PROFILE

155

©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample

7

COMPANIES CITED IN THE REPORT

Almalence, Ambarella, Apple, Agilent, Arm, Axis, Basler, Bosch, Brigates, BYD, Caeleste, Canon, Clairpixel, Cmosis, Cognex,
Continental, Core Photonics, Crysview, CSEM, Dongbu HiTek, DXO, Dynamax, e2v, Espros, Evg, Excelitas, Fairchild Imaging,
Flir, Forza Silicon, Fotonic, Foxconn, Fraunhofer, Fujitsu, Fujifilm, GalaxyCore, Given Imaging, GoPro, Grace Valley, Hamamatsu,
Hassellblad, Heliotis, Himax imaging, Honneywell, Hoya, HTC, Huawei, SK Hynix, Image Lab, Imec, Infineon, Invisage,
Invensense, JVC Altasens, Kingpak, Konica Minolta, Lattice, Leap Motion, Leica, Lenovo, LFoundry, LG, Luxima, Lytro, Magna,
Magneti Marelli, Mantis Vision, Medigus, Melexis, Mesa Imaging, Micron, Microsoft, Mobileye, Mobotix, Movidius, New Imaging
Technologies, Nikon, NXP, Nvidia, Odos Imaging, Omnivision, Omron, ON Semi, Panasonic, Pelican Imaging, PerkinElmer,
Philips, Pixart, PixelPlus, Pelco, PMD Technologies, Point Grey Research, Pyxalis, Raytrix, Rosnes, Samsung, Sanei Hytech, SETi,
Sharp, SiliconFile, Sirona, Soft Kinetic, SK Hynix, SMIC, Siemens, Socionext, Softkinetics, Soitec, Sony, STMicroelectronics,
SuperPix, Teledyne Dalsa, Teradyne, Tessera, Toshiba, Trixell, Tsmc, Toshiba Teli, TowerJazz, Tridicam, UMC, Valeo, Videantis,
Viimagic, WLCSP, Xiaomi, X-Fab, XinTec, ZTE and more …

©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample

8

ABOUT THE AUTORS OF THIS REPORT
Biography & contact

Pierre Cambou
From 1999, Pierre Cambou has been part of the imaging industry. Pierre took several positions at Thomson TCS which became
Atmel Grenoble in 2001 and e2v Semiconductors in 2006. In 2012 he founded a start-up called Vence Innovation (now Irlynx) in
order to bring to market a disruptive infrared Man to Machine interaction technology. He has an Engineering degree from
Université de Technologie de Compiègne and a Master of Science from Virginia Tech. More recently he graduated from Grenoble
Ecole de Management’s MBA. He joined Yole Développement as Imaging Activity Leader in 2014.
Contact: cambou@yole.fr
Jean-Luc Jaffard
From 1966 Jean-Luc Jaffard paved the way of imaging activity at STMicroelectronics being at the forefront of the emergence and

growth of this business. At STMicroelectronics Imaging Division he was successively appointed as Research Development and
Innovation Director managing a large multidisciplinary and multicultural team and later on promoted to Deputy General
Manager and Advanced Technology Director in charge of identifying and developing breakthrough Imaging Technologies and to
transform them into innovative and profitable products. In 2010 he was appointed STMicroelectronics Intellectual Property
Business Unit Director. In January 2014 he created the Technology and Innovation branch of Red Belt Conseil.

©2016 | www.yole.fr | Status of ©2015 | www.yole.fr | Camera Module| Industry
the CMOS image sensor industry Sample

9

Body sample

© 2016

WHAT WE GOT RIGHT WHAT WE GOT WRONG
Forecast over the years

We are raising our
forecast for CMOS
Image Sensors

The main reason for
this forecast increase is
the early introduction of
dual cameras in
smartphones

2010 Fcst

2012 Fcst

2014 Fcst

2015 Fcst

2016 Fcst

20 000
18 000
16 000
14 000

Revenue ($M)

Our goal is to
predict +/-10% in
5 years time

Mostly driven by
smartphone camera
crase and the renewal
of applications in the
consumer space, CIS
market keeps its
momentum while
passing the $10B
landmark

Historical revenue forecast (in $M)

12 000
10 000
8 000
6 000
4 000
2 000
0
2007

2008

2009

2010

2011

2012

2013

2014

2015

2016

2017

2018

2019

2020

2021

©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample

11

5TH CMOS IMAGE SENSOR REPORT

• When Yole Développement presented its first report in 2010, the imaging industry was at a turning point as CMOS
image sensor revenues were breaking the 50% threshold in respect to CCD.
• Since last year, the industry has reached the $10B landmark and has become a key technology for major
semiconductor companies such as Sony, Samsung,On Semi and now SK Hynix.
Imaging has
become a
mature
industry

• Mobile remains the key application market for CIS, it is demanding in term of volume and performances therefore
ASP are kept at a good level for the top notch technology. The industry has reached $10.3B in 2015 and with 10.4%
CAGR forecasted for the 2015-2021 period, and will reach $18.8B in 2021.
• Currently the most dynamic CIS markets are mobile and automotive. New features and performance are needed to
serve those markets.

©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample

12

CMOS IMAGE SENSOR PLAYERS
2015 CIS market landscape by player

SK Hynix confirmed it
was able to supply this
technologically
demanding market as
it proved itslelf an
alternative to
Galaxycore

2015 - CIS market landscape
by player
1 000
High End
Players End
High
Players
Teledyne Dalsa

100

$3.0B
$1,2B
$0.2B

Hamamatsu
Excelitas
Fairchild
Canon

Average Selling Price ($)

Sony is now
taking the lead in
volume

Leveraging its
technology leadership
roothed in digital
photography and
applied to mobile
markets and benefiting
from resolution
increases of mobile
secondary camera,
Sony grabbed both
revenue and volume
leadership in 2015

AMS Cmosis
e2v

Samsung

Sharp

10

On Semi
Panasonic
STMicro

Sony

Toshiba

Pixart

1

Galaxycore

Pixelplus

Omnivision

Himax
Superpix
0
-100

100

SK Hynix

2nd Tier Players
2nd Tier Players

300

Key Players
Key Players

500
700
Volume Shipment (M units)

900

1 100

1 300

©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample

13

CIS REVENUE BREAKDOWN (IN $M)
by market

2015 CIS Revenue breakdown
by market

2014

2015
CIS Revenue
breakdown

Mobile
Consumer
Computing
Automotive
Medical
Security
Industrial/Space/Defe
nce
TOTAL

2015

$5,908
$1,611
$1,187
$279
$29
$140

$6,665
$1,401
$1,052
$537
$34
$388

12%
1%
-3%
23%
15%
11%

$146

$271

10%

$9,300

CAGR2015-2021

Medical
0,3%

$10,348 10,4%

Security
3,8%

Industrial/Space/Defence
2,6%

Automotive
5,2%

Computing
10,2%

2014

2015

$9,300M

$10,348M

Consumer
13,5%

Mobile
64,4%

©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample

14

CIS REVENUE RANKING (IN $M)
by player

2015 CIS Revenue market share
by player
Company

2015
CIS Revenue
ranking

2014

2015
(in $M)

1
Sony
2
Samsung
3 Omnivision
4
On Semi
5
Canon
6
Toshiba
7 Panasonic
8
SK Hynix
9 Galaxycore
10 STMicro
11
Pixart
12 Pixelplus
Other

$2,779
$1,825
$1,378
$670
$482
$360
$244
$200
$325
$260
$166
$114
$498
$9,300

$3,645
$1,930
$1,250
$810
$404
$350
$336
$325
$275
$200
$170
$130
$523
$10,348

YoY
Growth
(%)
31%
6%
-9%
21%
-16%
-3%
38%
63%
-15%
-23%
2%
14%
5%

STMicro
2%
Galaxycore
3%
SK Hynix
3%

PixartPixelplus
1%
2%

Other
5%

Sony
35%

Panasonic
3%
Toshiba
3%

Yole Développement © May 2016

2014

2015

$9,300M

Canon
4%

$10,348M

On Semi
8%

Omnivision
12%

Samsung
19%

©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample

15

MOBILE MARKET TREND
The mobile camera will become a multi sensor optronics interface

# of sensors

Technology is
almost ready
Players are
working on
the killer
applications

3+ sensors

3 sensors

Photography
& video

Embedded 3D
Interactive

Embedded 3D
computational
Courtesy of Sony

The world becomes interactive

New embedded 3D imaging

Catching up with
DSLR and video
cameras

2 sensors
• Main & sub
camera
• Range finder
• LED Flash

1 sensor

• Main & sub
camera
• LED Flash

2012

2014

• Dual main or
sub camera
• 3D sensing
• LED Illuminator

Courtesy of Microsoft

Courtesy of Panono

2016

2018

• Dual Main & sub
camera
• 3D mapping
• VR localization

2020

2022

©2016 | www.yole.fr | Status of ©2015 | www.yole.frsensor industry |Industry
the CMOS image | Camera Module Sample

16

MOBILE MARKET TREND
Dual camera rollout scenario
Dual camera
Penetration
(%)

20%

The question is
no more if but
when?

iPhone 7 & 7S
with dual camera
Front or back ?

Breaking the 20%
threshold means Apple
or Samsung have
integrated at least one
dual camera

Samsung should
follow
accordingly

10%

P9 (Rear 13+13Mp)

Next HW updates
for Apple

G5 (Rear 16+8Mp)
2%

Yole Développement © May 2016

2016

2017

2018

2019

2020

2021

©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample

17

CONSUMER MARKET TREND
Light field imaging has many intermediaries
Processing x
Complexity

Interactive
World
- Virtual
Reality 3D/Sphere
Video

- Enhanced videocall
- Morphing

3D

Sphere Video

Pandora’s
box is open

3D

- Video/Movies
- Videochat

3D

Augmented/
Mix Reality

Video

3D
2D

Video
Photosphere

2D

Photosphere

virtual world
with interaction
- Photosphere
3D

Photo

- Object Mapping
-Smart environment
interaction

- Photosphere

2D

- Picture
- Selfie

3D

4D

Evolution

©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample

18

USE OF MACHINE VISION TECHNOLOGY
Disruptive vision sensing technology is transforming all markets

Generation of images
are less and less
intended for human
usage
Robotics and
Immersive
technologies
will transform
the imaging
landscape

Machines have great
need of sensory input
for autonomy &
interaction

Medical
Systems

Industrial
Military
& Scientific

Automotive
& Transport
Video
Camcorders

Low Volumes
1M units

Mobile Phones

Security &

CIS sensors are a key Surveillance
part of this technology
revolution

>1B units

>10M units

DSLR & DSC
Cameras

>100M units

High Volumes
Consumer
robot

Notebook & tablets

Viewer & Gaming
devices
©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample

19

EVERY YEAR, YOLE DÉVELOPPEMENT ATTENDS MAIN EVENTS. MEET WITH US AT*:
• NEPCON Japan
January 13-15, 2016 – Tokyo, Japan
• CS International
March 1-2, 2016 – Brussels, Belgium
• Image Sensors
March 15-17, 2016 – London, UK
• International Conference and Exhibition on
Device Packaging
March 15-17, 2016 – Fountain Hills, USA
• Lab-on-a-Chip European Congress
March 15-16, 2016 – Madrid, Spain
• APEC
March 20-24, 2016 – Long Beach, USA
• PCIM Europe
May 10-12, 2016 – Nuremberg, Germany

• ECTC
May 31-June 3, 2016 – Las Vegas, USA
• Sensors Expo & Conf
June 21-23, 2016 – San José, USA

• SEMICON West
July 12-15, 2016 – San Francisco, USA
• LED Professional Symposium – LpS
September 20-23, 2016 – Bregenz, Austria
• SEMICON Europa
October 25-27, 2016 – Grenoble, France

• SEMICON Japan
December 14-16, 2016 – Tokyo, Japan
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©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample

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To ensure the payments, the Seller reserves the right to request
down payments from the Buyer. In this case, the need of down
payments will be mentioned on the order.
3.4  ayment is due by the Buyer to the Seller within 30 days
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from invoice date, except in the case of a particular written
agreement. If the Buyer fails to pay within this time and fails
to contact the Seller, the latter shall be entitled to invoice
interest in arrears based on the annual rate Refi of the «BCE»
+ 7 points, in accordance with article L. 441-6 of the French
Commercial Code. Our publications (report, database, tool...)
are delivered only after reception of the payment.
3.5 n the event of termination of the contract, or of misconduct,
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during the contract, the Seller will have the right to invoice
at the stage in progress, and to take legal action for damages.
4. LIABILITIES
4.1  he Buyer or any other individual or legal person acting on
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its behalf, being a business user buying the Products for its
business activities, shall be solely responsible for choosing the
Products and for the use and interpretations he makes of the
documents it purchases, of the results he obtains, and of the
advice and acts it deduces thereof.
4.2  he Seller shall only be liable for (i) direct and (ii) foreseeable
T
pecuniary loss, caused by the Products or arising from a
material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental
or consequential damages (including, but not limited to,
damages for loss of profits, business interruption and loss of
programs or information) arising out of the use of or inability
to use the Seller’s website or the Products, or any information
provided on the website, or in the Products;
b) any claim attributable to errors, omissions or other
inaccuracies in the Product or interpretations thereof.
4.4  ll the information contained in the Products has been
A
obtained from sources believed to be reliable. The Seller
does not warrant the accuracy, completeness adequacy or
reliability of such information, which cannot be guaranteed to
be free from errors.
4.5  ll the Products that the Seller sells may, upon prior notice
A
to the Buyer from time to time be modified by or substituted
with similar Products meeting the needs of the Buyer. This
modification shall not lead to the liability of the Seller,
provided that the Seller ensures the substituted Product is
similar to the Product initially ordered.
4.6 n the case where, after inspection, it is acknowledged that
I
the Products contain defects, the Seller undertakes to replace
the defective products as far as the supplies allow and without
indemnities or compensation of any kind for labor costs,
delays, loss caused or any other reason. The replacement is
guaranteed for a maximum of two months starting from the
delivery date. Any replacement is excluded for any event as set
out in article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing

of the Products are given for information only and are not
guaranteed. If such deadlines are not met, it shall not lead to
any damages or cancellation of the orders, except for non
acceptable delays exceeding [4] months from the stated
deadline, without information from the Seller. In such case only,
the Buyer shall be entitled to ask for a reimbursement of its first
down payment to the exclusion of any further damages.

4.8  he Seller does not make any warranties, express or implied,
T
including, without limitation, those of sale ability and fitness for
a particular purpose, with respect to the Products. Although
the Seller shall take reasonable steps to screen Products for
infection of viruses, worms, Trojan horses or other codes
containing contaminating or destructive properties before
making the Products available, the Seller cannot guarantee
that any Product will be free from infection.
5. FORCE MAJEURE
The Seller shall not be liable for any delay in performance directly
or indirectly caused by or resulting from acts of nature, fire, flood,
accident, riot, war, government intervention, embargoes, strikes,
labor difficulties, equipment failure, late deliveries by suppliers or
other difficulties which are beyond the control, and not the fault
of the Seller.
6. PROTECTION OF THE SELLER’S IPR
6.1 All the IPR attached to the Products are and remain the

property of the Seller and are protected under French and
international copyright law and conventions.
6.2  Buyer agreed not to disclose, copy, reproduce,
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redistribute, resell or publish the Product, or any part of it
to any other party other than employees of its company. The
Buyer shall have the right to use the Products solely for its
own internal information purposes. In particular, the Buyer
shall therefore not use the Product for purposes such as:
• Information storage and retrieval systems;
•  ecordings and re-transmittals over any network (including
R
any local area network);
•  se in any timesharing, service bureau, bulletin board or
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similar arrangement or public display;
•  osting any Product to any other online service (including
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bulletin boards or the Internet);
•  icensing, leasing, selling, offering for sale or assigning the
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Product.
6.3  he Buyer shall be solely responsible towards the Seller of
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all infringements of this obligation, whether this infringement
comes from its employees or any person to whom the Buyer
has sent the Products and shall personally take care of any
related proceedings, and the Buyer shall bear related financial
consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for

the needs of the contract. This person will be the recipient
of each new report in PDF format. This person shall also be
responsible for respect of the copyrights and will guaranty that
the Products are not disseminated out of the company.
6.5 n the context of annual subscriptions, the person of contact
I
shall decide who within the Buyer, shall be entitled to access
on line the reports on I-micronews.com. In this respect, the
Seller will give the Buyer a maximum of 10 password, unless
the multiple sites organization of the Buyer requires more
passwords. The Seller reserves the right to check from time
to time the correct use of this password.
6.6 n the case of a multisite, multi license, only the employee
I
of the buyer can access the report or the employee of the
companies in which the buyer have 100% shares. As a matter
of fact the investor of a company, the joint venture done with
a third party etc..cannot access the report and should pay a
full license price.
7. TERMINATION
7.1 f the Buyer cancels the order in whole or in part or postpones
I
the date of mailing, the Buyer shall indemnify the Seller for
the entire costs that have been incurred as at the date of
notification by the Buyer of such delay or cancellation. This
may also apply for any other direct or indirect consequential
loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions

or the order, the non-breaching Party may send a notification
to the other by recorded delivery letter upon which, after a
period of thirty (30) days without solving the problem, the
non-breaching Party shall be entitled to terminate all the
pending orders, without being liable for any compensation.
8. MISCELLANEOUS
All the provisions of these Terms and Conditions are for the
benefit of the Seller itself, but also for its licensors, employees
and agents. Each of them is entitled to assert and enforce those
provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in
writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and
Conditions and the Buyer, is deemed to have accepted the latest
version of these terms and conditions, provided they have been
communicated to him in due time.
9. GOVERNING LAW AND JURISDICTION
9.1 ny dispute arising out or linked to these Terms and
A
Conditions or to any contract (orders) entered into in
application of these Terms and Conditions shall be settled
by the French Commercial Courts of Lyon, which shall have
exclusive jurisdiction upon such issues.
9.2  rench law shall govern the relation between the Buyer and
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the Seller, in accordance with these Terms and Conditions.

Yole Développement
From Technologies to Market

© 2016

FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas
Imaging

Photonics

MEMS &
Sensors

MedTech

Compound
Semi.

Manufacturing
LED

Power
Electronics

Advanced Packaging
Batteries / Energy
Management

©2016 | www.yole.fr | About Yole Développement

22

4 BUSINESS MODELS
o Consulting and Analysis






o Financial services

Market data & research, marketing analysis
Technology analysis
Strategy consulting
Reverse engineering & costing
Patent analysis







M&A (buying and selling)
Due diligence
Fundraising
Maturation of companies
IP portfolio management & optimization

www.yole.fr

www.yolefinance.com
www.bmorpho.com

o Media

o Reports
• Market & Technology reports
• Patent Investigation and patent infringement risk
analysis
• Teardowns & Reverse Costing Analysis
• Cost Simulation Tool






i-Micronews.com website
@Micronews e-newsletter
Communication & webcast services
Events

www.i-Micronews.com

www.i-Micronews.com/reports

©2016 | www.yole.fr | About Yole Développement

23

A GROUP OF COMPANIES
M&A operations
Due diligences
www.yolefinance.com

Innovation and business maker
www.bmorpho.com

Market,
technology and
strategy
consulting
www.yole.fr

Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr

IP analysis
Patent assessment
www.knowmade.fr

©2016 | www.yole.fr | About Yole Développement

24

OUR 2016 REPORTS PLANNING
o MEMS & SENSORS
− Gas Sensors and Combos 2016
− Status of the MEMS Industry 2016*
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads: Towards New Printing Opportunities
2016…
− Sensors for Biometry and Recognition 2016
− Finger Print Sensors Market and Technologies 2016
− 3D Imaging & Sensing 2016**
− Silicon Photonics 2016
− Emerging Non Volatile Memories 2016*
o IMAGING & OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016*
− Uncooled Infrared Imaging Technology & Market Trends 2016*
− Imaging Technologies for Automotive 2016
− Sensors for Drones & Consumer Robots 2016
− 3D Imaging & Sensing 2016**
− Silicon Photonics 2016
o MEDTECH
− BioMEMS 2016
− Point of Need Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− FanOut WLP: Technology Trends and Business Update 2016*
− Embedded Die Packaging: Technology and Markets Trends 2016*
− 2.5D & 3D IC Business Update 2016
− Status of the Advanced Packaging Industry 2016*
− Advanced Packaging for Wearables and Mobile Applications 2016
− Advanced Packaging in Emerging Markets: China 2016
− Supply Chain Readiness for Panel Manufacturing in Packaging 2016
o MANUFACTURING
− Inspection and Metrology Technology and Applications Trends in Advanced Packaging 2016**
− Emerging Materials for Advanced Packaging 2016

− Deposition Technologies Equipment & Materials 2016
− Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS 2016
o COMPOUND SEMICONDUCTORS
− SiC Modules, Devices and Substrates for Power Electronics 2016*
− GaN Modules, Devices and Substrates for Power Electronics 2016*
− Sapphire Applications & Market 2016: from LED to Consumer Electronics*
− RF GaN Technology and Market Analysis 2016
o LED







Sapphire Applications and Market 2016: From LED to Consumer Electronics*
LED Packaging 2016
Microdisplays and MicroLEDs
UV LED Technology, Manufacturing and Applications Trends 2016*
OLED for Lighting 2016
LED in Automotive Lighting 2016

o POWER ELECTRONICS
− Power Electronics in Electric and Hybrid Vehicles 2016
− Status of Power Electronics Industry 2016*
− Passive Components Technologies and Market Trends for Power Electronics 2016
− SiC Modules, Devices and Substrates for Power Electronics 2016*
− GaN Modules, Devices and Substrates for Power Electronics 2016*
− Inverter Technologies Trends & Market Expectations 2016
− Power Electronics for Renewable Energy 2016
− Thermal Management for LED and Power 2016
− RF GaN Technology and Market Analysis 2016
o

BATTERY
− Market Trends and Technologies in Battery Pack and Assembly 2016
− Innovative and Emerging Technologies in Energy Storage Market 2016
**To be confirmed

Patent Analysis by Knowmade and Teardown & Reverse Costing by System Plus Consulting are available on
www.i-micronews.com
©2016 | www.yole.fr | About Yole Développement

25

OUR 2015 PUBLISHED REPORTS LIST
o MEMS & SENSORS
− Sensors and Data Management for Autonomous Vehicles
− Sensors for Wearable Electronics And Mobile Healthcare
− Status of the MEMS Industry
− Uncooled Infrared Imaging Technology & Market Trends
− Infrared Detector Technology & Market Trends
− High-End Gyroscopes, Accelerometers and IMUs for Defense, Aerospace & Industrial
− Emerging Non Volatile Memory (NVM) Technology & Market Trends
o IMAGING & OPTOELECTRONICS
− Camera Module Industry
− Uncooled Infrared Imaging Technology & Market Trends
− Status of the CMOS Image Sensors
− Infrared Detector Technology & Market Trends

o POWER ELECTRONICS
− Power Packaging Technology Trends and Market Expectations
− Energy Management for Smart Grid, Cities and Buildings: Opportunities for Battery
Electricity Storage Solutions
− Status of Chinese Power Electronics Industry
− New Technologies and Architectures for Efficient Data Center
− IGBT Market and Technology Trends
− Status of Power Electronics Industry
− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications
− GaN and SiC Devices for Power Electronics Applications

o ADVANCED PACKAGING
− Status of the Advanced Packaging Industry
− Supply Chain Readiness for Panel Manufacturing in Packaging
− Fan-in Wafer Level Packaging: Market and Technology Trends
o MEDTECH
− Flip Chip: Technologies and Markets Trends
− Sample Preparation Automation Through Emerging Microfluidic Technologies
− Fan-Out and Embedded Die: Technologies & Market Trends
− 2015 Microfluidic Applications in the Pharmaceutical, Life Sciences, In-Vitro Diagnostic, and
Medical Device Markets
− Sensors for Wearable Electronics And Mobile Healthcare
o MANUFACTURING
− Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED
Applications
o COMPOUND SEMICONDUCTORS
− Emerging Non Volatile Memory (NVM) Technology & Market Trends
− Sapphire Applications & Market 2015: from LED to Consumer Electronics

− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications
− GaN and SiC Devices for Power Electronics Applications

Patent Analysis by Knowmade and Teardown & Reverse Costing by System Plus Consulting are
available on www.i-micronews.com

o LED





LED Lighting Module Technology, Industry and Market Trends 2015
UV LED - Technology, Manufacturing and Application Trends
Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays
Sapphire Applications & Market 2015: from LED to Consumer Electronics

©2016 | www.yole.fr | About Yole Développement

26

CONTACT INFORMATION


Consulting and Specific Analysis






Report business









North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr
Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service
Email: khamassi@yole.fr
Japan & Asia: Takashi Onozawa, Representative Director, Yole KK.
Email: onozawa@yole.fr
Korea: Hailey Yang, Business Development Manager, Korean Office
Email: yang@yole.fr
Taiwan: Mavis Wang, Business Development Director
Email: wang@yole.fr

Follow us on

Financial services




North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr
Japan & Asia: Takashi Onozawa, Representative Director, Yole KK
Email: onozawa@yole.fr
RoW: Jean-Christophe Eloy, CEO & President, Yole Développement
Email eloy@yole.fr

Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr

General


Email: info@yole.fr

©2016 | www.yole.fr | About Yole Développement

27