Strategy For The Future: Delivering High-Added Values From an Equipment Supplier

Strategy For The Future: Delivering High-Added Values From an Equipment Supplier

Loading
Loading Social Plug-ins...
Language: English
Save to myLibrary Download PDF
Go to Page # Page of 19

Description: As new and innovative applications emerge, semiconductors are required to evolve further. Customers’ needs get diversified. We continue to provide leadingedge technologies that support customer’s further scaling while providing solutions to customers’ needs by upgrading their existing manufacturing technologies.

 
Author: Tony Kawai  | Visits: 325 | Page Views: 499
Domain:  High Tech Category: Semiconductors 
Upload Date:
Link Back:
Short URL: https://www.wesrch.com/electronics/pdfEL1SE1000GWPH
Loading
Loading...



px *        px *

* Default width and height in pixels. Change it to your required dimensions.

 
Contents:
Strategy for the Future
Delivering high-added values from an equipment supplier
September 7, 2016
Tony Kawai
President & CEO
Tokyo Electron Limited

Why was Pokemon-GO release
delayed in its home ground Japan ?

Because of the server capacity
Pixabay.com

T. Kawai / September 7, 2016

2

User’s frustration is…
Battery runs out soon

5%
Because of AR and GPS which consume high-power
Pixabay.com

T. Kawai / September 7, 2016

3

Autonomous driving will transform society

It requires sensor systems and AI enabling advanced
ja.wikipedia.org
semiconductor
T. Kawai / September 7, 2016

4

New wave of IoT technologies

AR

VR

Cloud
FinTech

AI

Advanced
Robotics

Autonomous
Driving

New disruptive technologies require higher performance,
lower power and higher reliability devices
T. Kawai / September 7, 2016

5

Semiconductor technology roadmap
2015
Logic
DRAM

2016

14nm
20nm

3D NAND

2018

1Xnm
48 layer

as of April 2016

2019

10nm

2020

7nm
1Ynm

1Znm

64 layer

96 layer
STT-MRAM

Emerging Memory

ReRAM, XPoint

Advanced Package

Logic

2017

Source: TEL marketing,

Fan Out-WLP / 2.5D, 3D

DRAM

3D NAND

Emerging Memory
STT-MRAM

XPoint

As technology becomes complex,
the role of equipment supplier is getting more critical
T. Kawai / September 7, 2016

6



TEL leading-edge technologies
Coater/
developers

CLEAN TRACK™
LITHIUS Pro™ AP

Coater/
developers

CLEAN TRACK™
LITHIUS Pro™ Z

Cleaning

CELLESTA™-i

Electroplating

PVD

Apollo

Plasma
etching

Bonder

Stratus™

Thermal
processing

Tactras™

TELINDY
PLUS™

Prober

Precio™

Synapse™ S

CVD

Triase+™

ALD

PVD

NT333™

EXIM™

Quest for leading-edge solutions with wide range of products
T. Kawai / September 7, 2016

7

Integrated technology is becoming more essential

SAMP

SAC

(self-aligned multiple patterning)

(self-aligned contact)

SAMP requires ALD,
which can control
deposition thickness at
the nm scale

44nm hp

22nm hp

11nm hp

ALD and ALE are
indispensable to SAC,
which is now dominant in
MOL contact

5.5nm hp

We propose optimized solutions which solve customer’s
critical problems by integrating our various technologies
T. Kawai / September 7, 2016

8

TEL- IMEC partnership since 1998
Intg. Patterning
Adv. Interconnect
DSA
3DI
Logic
Memory ReRAM

STT -MRAM

248 nm, Immersion and EUV
8
1998

2004

2005

2006

2007

2008

2009

2010

2011

2012

2013

2014

2015

2016

This collaboration began with lithography area,
Now expanded to other key technology programs
T. Kawai / September 7, 2016

9

TEL - Tohoku University partnership for STT-MRAM
STT-MRAM

Device
maker

System
maker

2Mb STT-MRAM fabricated with 90nmCMOS/60nm MTJ
adapting on-via MTJ cell structure


Materials
maker

Metrology
tool maker

60% cell size reduction
(vs. conventional off-via MTJ cell )



Over 95% average yield

Achieved with TEL’s PVD & RIE
H. Koike et al. @ IMW2016

*CIES: Center for innovative integrated electronic systems
in Tohoku University since 2012.

By courtesy of Professor Endoh, Director of CIES

Significant results achieved by open innovation
T. Kawai / September 7, 2016

10

New wave of IoT technologies

AR

VR

Cloud
FinTech

AI

Advanced
Robotics

Autonomous
Driving

Existing technologies just as important as innovative
technologies
T. Kawai / September 7, 2016

11

Semiconductor manufacturing process node for IoT
Wafer Consumption by Node
(Mil. sq. inch)
12,000

7nm
10nm
14nm
20nm
28nm
45nm
65nm
90nm
0.13micron
0.18micron
0.25micron
0.35micron
0.5micron

90nm

10,000
8,000
6,000
4,000
2,000
0

2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020
Source : IHS, Semiconductor Silicon Forecast Tracker Q2, 2016

Leading-edge

Mature
Technology

Forecast

Manufacturing process node going multi-generational
Existing manufacturing lines just as important
T. Kawai / September 7, 2016

12

Our strategic directions in IoT era

Provide leading-edge equipment
Improve performance of
legacy equipment

Respond to customer needs in all generations
T. Kawai / September 7, 2016

13

Providing solutions for equipment in the field - capacity
TEL’s world-wide installed base: 60,000 units
(Taiwan 12,000 units)
Upgrades to leading-edge
technology

TEL-certified used
equipment

Fully support customers’ diversified needs driven by IoT
T. Kawai / September 7, 2016

14

Providing solutions for equipment in the field - productivity
Intelligent Remote Service

TELeMetrics™
TEL real-time
Database server

Customer
fab site
Internet

DB

27%
35%
20%
10%

reduction in MTTR
reduction in process variability
reduction of consumables
improvement in throughput

Actual values based on specific situations. Results may vary.

Increase equipment productivity and lower
manufacturing costs

T. Kawai / September 7, 2016

15

Providing further values - smart manufacturing

Intelligent equipment
• Sensing & AI technology
• Optimal process control
• Self-diagnosis
• Predictive fault detection

Smart manufacturing realized by intelligent equipment
T. Kawai / September 7, 2016

16

Taiwan, the largest spender and the largest wafer capacity
holder
Wafer-fab equipment
spending in 2015
Europe Other
4%
6%
China
Taiwan
12%

26%

U.S.
15%
Japan
15%

Wafer capacity at Dec-2015
Other
Europe 10%
6%
China
10%
US 14%

Korea
22%
Source: VLSI Research

Japan
17%

Taiwan
22%
Korea
21%
Source:IC Insights, Monthly installed
capacity in 200mm equivalents

Taiwan plays a critical role in the semiconductor industry
both in terms of “production” and “technology development”
T. Kawai / September 7, 2016

17

Summary
 As new and innovative applications emerge, semiconductors are
required to evolve further
 Customers’ needs get diversified. We continue to provide leadingedge technologies that support customer’s further scaling, while
providing solutions to customers’ needs by upgrading their existing
manufacturing technologies
 TEL is fully committed to support semiconductor industry in Taiwan
which is a critical base both in terms of “production” and
“technology development”
T. Kawai / September 7, 2016

18

T. Kawai / September 7, 2016

19