In-line High Resolution 3D Surface Measurements for Substrate Characterization

In-line High Resolution 3D Surface Measurements for Substrate Characterization

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Description: 4D Technology Designs Metrology for Challenging Situations:- We create innovative optical instruments for precision measurement in dynamic environments to enable discovery and drive process excellence. 4D instruments measure surface shape, roughness, defects, wavefront and polarization, enabling our customers to: Build next generation optical instruments-Space-based optical systems, Large astronomical telescopes. Improve manufacturing of industrial and consumer products.

Semiconductors, displays, data storage. Flexible electronics.

 
Author: Erik Novak PhD (Senior) | Visits: 285 | Page Views: 609
Domain:  High Tech Category: Semiconductors 
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Short URL: https://www.wesrch.com/electronics/pdfEL1SE1000LDHY
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Contents:
In-line High Resolution 3D Surface Measurements
for Substrate Characterization
Dr. Erik Novak
Director of Businses Development, 4D Technology

4D Technology Designs Metrology for
Challenging Situations
We create innovative optical instruments for
precision measurement in dynamic environments
to enable discovery and drive process excellence.
4D instruments measure surface shape, roughness, defects,
wavefront and polarization, enabling our customers to:


Build next generation optical instruments
• Space-based optical systems
• Large astronomical telescopes



Improve manufacturing of industrial and
consumer products
• Semiconductors, displays, data storage
• Flexible electronics



Increase fundamental understanding
• Bio-medical research
• Astronomy

10/27/2016

4D Has a Strong Team and World-Class
Facilities
• History





Founded in California, Jan 2000
Chairman: Dr. James Wyant
(Wyko/Veeco, U of A Dean of Optical Sciences)
12th year of operation in Tucson, AZ

 15,000 ft2 office, production, & labs
 38 Employees


More than 60% hold advanced degrees

 Core Expertise
Metrology Solutions

Opto-Mech Design

Software

Manufacturing

FlexCam Provides Fast 3D Metrology For
Precision Film Manufacturing











100% coverage in machine direction up to 1m/min speed
2 µm lateral resolution
Solid-state: no moving parts!
Sub-nm vertical resolution
4mm transverse coverage per module
Vacuum compatible design
21 mm standoff distance
Webs down to 25 µm thickness
Immune to backside and roller reflections
± 30 µm roller runout allowed
4D Technology

4

High Speed Metrology Enables Detailed
Process Studies
• FlexCam provides 3D roughness and defect information at
– 14 cm2 / sec capture rate
– 5000X higher throughput than a 3D microscope
– 2 um lateral resolution

• Vitriflex is a leading developer of high-performance transparent
ultrabarrier films for displays & flexible electronics, using a R2R
process
• FlexCam Enables Vitriflex To:
– Evaluate incoming substrate quality
– Examine how various 3D parameters on substrate affect final barrier film
quality
– Examine effect of process changes on barrier film quality

10/27/2016

5

Experimental Setup
• 3, 1m wide substrates tested at Vitriflex
– Both coated and uncoated versions, various process
parameters changed

• FlexCam mounted above winder/rewinder for
measurements
• Substrates moving at 1.1m/minute during tests
• FlexCam used in Engineering Mode, where 100% of
XYZ surface is captured
– This provides 15% sampling in machine direction
– 100% coverage possible if only defect and roughness
statistics are saved

• Data was analyzed for roughness, defects, and also
visual examination of the 3D images was performed

Substrate 1: Uncoated – Honeycomb Pattern,
Rejected Substrate

10/27/2016

7

Examination of Various Process Variables
Allows Quantitative Optimization
Process Variation

Average Roughness (Sa)

RMS Roughness (Sq)

Uncoated

4.2

5.8

Plasma Pre-Treatment

4.6

6.7

P01

3.3

4.1

P02

2.9

3.6

P03

3.7

4.7

P04

3.5

4.5

P05

3.1

4.0

P06

3.2

4.4

P07

3.9

5.6

P08

3.6

5.2

P09

3.8

4.8

P10

4.0

5.4

10/27/2016

8

Examination of 3D Defect Count for 10nm, 700
um2 Defects Shows Different Optimal Process
Process Variation

Avg Defects per 0.7 mm2

Max Defects per 0.7 mm2

Uncoated

1.4

6

Plasma Pre-Treatment

2.5

9

P01

2.6

8

P02

0.8

7

P03

4

18

P04

3.1

12

P05

1.1

6

P06

2.4

9

P07

1.6

11

P08

0.4

3

P09

4.6

15

p10

1.6

15

10/27/2016

9

Substrate 1: Plasma Pre-Treatment Area

10/27/2016

10

Substrate 1: Process 02: Lowest Ra, Few
Defects

10/27/2016

11

Substrate 1: Process 09: High Ra, Highest
Defects

10/27/2016

12

Substrate 1: Process 08 Variation Over 1m

• Roughness fairly constant,
with random fluctuations
• # of voids is increasing with
time, however

10/27/2016

13

Substrate 1: Process 09 Variation Over 1m

• Roughness again constant
with random fluctuations
• Opposite trend vs. P08 on
defect count

10/27/2016

14

Substrate 2: Examination Shows Significant
Differences from Substrate 1






Improved substrate, different characteristic defects
Capable of < 5e-4 grams/m2/day
Used for solar encapsulation
Substrate roughness similar before and after coating
>10nm tall defects reduced by factor of 7

Avg
Roughness –
Sa (nm)

RMS
Roughness –
Sq (nm)

Avg Defects
per FOV

Max Defects
per FOV

Uncoated

3.3

4.6

6

25

Coated

3.3

4.4

0.9

3

10/27/2016

15

Substrate 2: Uncoated

10/27/2016

16

Substrate 2: Coated

10/27/2016

17

Substrate 2: 1m Coated Length Examined in
Left, Center, and Right Regions
Location on
Substrate

Avg
Roughness
(nm)

RMS
Roughness
(nm)

Avg
Defects/Field

Max
Defects/Field

Left 1/3

2.7

3.9

0.9

6

Center

2.9

4.3

1.3

15

Right 1/3

3.4

4.9

0.9

12

Substrate 2: 12m run Examined for Process
Variation
• Wanted to examine if there are longer-term periodic effects
associated with coating process
• Periodic roughness increases with a 0.5 m period
• Does not produce more 10nm deep defects

10/27/2016

19

Substrate 3: Examination Again Significant Differences
from Other Substrates
• Higher Quality Still
• Ra 1.17, Rq 1.5 9 (FC 2.9, 4.5)
• Capable of