Go to Page # Page of 42

CMP and Current Trends Related to Advanced Packaging

 Robert L. Rhoades PhD
  1st-Dec-2017
Description: Unlike retail or other types of packaging, the performance and reliability of an electronic component are closely tied to the proper design of the package.
Views: 1125
Domain: Electronics
Category: Semiconductors
Contributing Organization: NCCAVS
 ‐ More of their Presentations
Contents:
CMP and Current Trends Related to
Advanced Packaging
Robert L. Rhoades, Ph.D.
NCCAVS TFUG-CMPUG Joint Meeting
June 7, 2017

Semiconductor Equipment

Spare Parts and Service
Spare Parts and Service

CMP Foundry
Foundry

Click to edit Master title style
Outline

• Industry Trends

• Trends in Packaging
• Where is CMP used in next generation packaging?
• Summary

June 2017

NCCAV ... See more

Recent Presentations

...
19 July, 2018
...
18 July, 2018
...
17 July, 2018