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CMP and Current Trends Related to Advanced Packaging

 Robert L. Rhoades PhD
  1st-Dec-2017
Description: Unlike retail or other types of packaging, the performance and reliability of an electronic component are closely tied to the proper design of the package.
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Domain: Electronics
Category: Semiconductors
Contributing Organization: NCCAVS
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Maxims of Tech: Rules of Engagement for a Fast Changing Environment
Contents:
CMP and Current Trends Related to
Advanced Packaging
Robert L. Rhoades, Ph.D.
NCCAVS TFUG-CMPUG Joint Meeting
June 7, 2017

Semiconductor Equipment

Spare Parts and Service
Spare Parts and Service

CMP Foundry
Foundry

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Outline

• Industry Trends

• Trends in Packaging
• Where is CMP used in next generation packaging?
• Summary

June 2017

NCCAV ... See more

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