Go to Page # Page of 42

CMP and Current Trends Related to Advanced Packaging

 Robert L. Rhoades PhD
  1st-Dec-2017
Description: Unlike retail or other types of packaging, the performance and reliability of an electronic component are closely tied to the proper design of the package.
Views: 1180
Domain: Electronics
Category: Semiconductors
Contributing Organization: NCCAVS
 ‐ More of their Presentations
Contents:
CMP and Current Trends Related to
Advanced Packaging
Robert L. Rhoades, Ph.D.
NCCAVS TFUG-CMPUG Joint Meeting
June 7, 2017

Semiconductor Equipment

Spare Parts and Service
Spare Parts and Service

CMP Foundry
Foundry

Click to edit Master title style
Outline

• Industry Trends

• Trends in Packaging
• Where is CMP used in next generation packaging?
• Summary

June 2017

NCCAV ... See more

Recent Presentations

Chee Wee Liu
17 October, 2018
...
16 October, 2018

SMIC on China Semiconductor Opportunity

This presentation contains, in addition to historical information, "forward-looking statements" within the meaning of the "safe harbor" provisions of the U.S. Private Securities Li

SMIC
15 October, 2018