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Advanced Packaging Enters Yield Management Era with KLA-Tencorís Kronosô 1080

 Risto Puhakka
Description: KLA-Tencorís Kronos 1080 delivers new solutions for advanced wafer-level packaging manufacturing and inspection.
Views: 664
Domain: Electronics
Category: Semiconductors
Contributing Organization: KLA-Tencor
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The Chip Insider®

November 15, 2018

Equipment & Emerging Markets
Advanced Packaging Enters in Yield Management Era
with KLA-Tencor’s Kronos™ 1080
• Advanced Packaging Is Requiring Yield Management
• From Quality Control to Yield Management
• Complex Metal Patterns in RDL
• Inspection for Modern Advanced Packaging Process
• Kronos™ 1080

• Tool ... See more
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