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Deep Silicon Etch Technology for Advanced MEMS Applications

 Shenjian Liu PhD
  1st-Jun-2017
Description: Innovative chamber design to provide solutions to all technical challenges in MEMS and TSV Etch Compact design to deliver high wafer output per footprint with. Low COO with dual chamber design Better temperature control than using dual zone backside He. Better cooling capacity than regular Single Zone ESC. Avoids ‘hot spot’ issues commonly encountered with embedded heaters running high RF power applications
Views: 900
Domain: Electronics
Category: Semiconductors
Contributing Organization: SEMICON Europa
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Maxims of Tech: Rules of Engagement for a Fast Changing Environment
Contents:
Deep Silicon Etch Technology for Advanced
MEMS Applications
Shenjian Liu, Ph.D.
Managing Director, AMEC

AMEC Company Profile and Product Line-up
AMEC HQ, R&D and MF Facility in Shanghai

AMEC
Taiwan

AMEC
Singapore

AMEC
Japan

AMEC
USA

AMEC
Korea

EUROPE
TELTEC
Service
Center

AMEC Product Line-up
Dielectric Etch

Poly Etch

Entered
international market
Processed over
24.5M 65-16nm
wafers

Sta ... See more

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