Deep Silicon Etch Technology for Advanced MEMS Applications

Deep Silicon Etch Technology for Advanced MEMS Applications

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Description: Innovative chamber design to provide solutions to all technical challenges in MEMS and TSV Etch Compact design to deliver high wafer output per footprint with. Low COO with dual chamber design Better temperature control than using dual zone backside He. Better cooling capacity than regular Single Zone ESC.

Avoids ‘hot spot’ issues commonly encountered with embedded heaters running high RF power applications .

 
Author: Shenjian Liu PhD  | Visits: 421 | Page Views: 856
Domain:  High Tech Category: Semiconductors 
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Short URL: https://www.wesrch.com/electronics/pdfEL1SE1000UOUN
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Contents:
Deep Silicon Etch Technology for Advanced
MEMS Applications
Shenjian Liu, Ph.D.
Managing Director, AMEC

AMEC Company Profile and Product Line-up
AMEC HQ, R&D and MF Facility in Shanghai

AMEC
Taiwan

AMEC
Singapore

AMEC
Japan

AMEC
USA

AMEC
Korea

EUROPE
TELTEC
Service
Center

AMEC Product Line-up
Dielectric Etch

Poly Etch

Entered
international market
Processed over
24.5M 65-16nm
wafers

Start to market
from 2016
12” advanced etch
for Memory Logic
applications

TSV/MEMS Etch

Entered
international market
Domestic market
share over 50%

MOCVD

VOC

Entered domestic
market
13 systems
delivered to
customers

Entered domestic
market
Targeting LCD
Industry

Presentation Outline

 The Market Trend
 The Technical Challenges in MEMS Etch
 AMEC’s Strategy and Solutions

 Summary

The Market Trend

MEMS Acceleration

Etch Is One of the Critical Process Steps for MEMS Fabrication
MEMS AND SENSORS IN MOBILE DEVICES

MEMS Etch Example by AMEC
Gyrometer

Microphone

Accelerometer

CIS CCD Isolation

Source: Yole Development, MSIG Asia, Shanghai, 2016

Technical Challenges in
MEMS Etch

Major Technical Challenges in MEMS Si etch

How to Minimize Profile Tilting?

Profile Tilting Is One of Major Issues in MEMS Si Etch
 Si profile tilting affects the resonance frequency of MEMS sensors