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InP DHBTs by Leveraging Heterogeneous Integration

 James Chingwei Li, HRL Laboratories LLC
  7th-Jun-2010
Description: Deep Sub-Micron CoSMOS technology overview: combines latest CMOS and InP DHBTs for high performance mixed signal design. Integration approach: Epitaxial transfer and fabrication of InP HBTs on top of fully fabricated CMOS - InP/Si BiCMOS Process flow Device performance Thermal Management Thermal Vias Metallic Sub-Collector (MSC) Extends Thermal Limits. HBTs CMOS Heterogeneous Interconnect Differential Amplifier Test vehicle Next generation development Thermal limits Metallic Sub-Coll
Views: 2303
Domain: Electronics
Category: Semiconductors
Maxims of Tech: Rules of Engagement for a Fast Changing Environment
Contents:
Leveraging Heterogeneous Integration with Deep Sub-Micron InP DHBTs James Chingwei Li
(310) 317-5820, jli@hrl.com

Y. Royter, T. Hussain, P.R. Patterson, J.R. Duvall, M.C. Montes, I. Valles, M.F. Boag-O'Brien, D. Le, D. Zehnder, E.F. Wang, D.A. Hitko, M. Sokolich, D.H. Chow, K.R. Elliott, P.D. Brewer

HRL Laboratories LLC, Malibu, CA 90265

2010 Communications Microsystems Optoelectronics S ... See more

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