Semiconductor Technology Driving Change

Semiconductor Technology Driving Change

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Description: Today's nanometer-scale Integrated Circuits (ICís) call for extensive changes in all facets of the design flow. The need for advanced interconnects and packages have become more critical. Mechanical issues and contact probing restrictions prevent testing during 3D multi-chip assembly process.

IC assembly and packaging flows are susceptible to yield excursions. Enabling a new level chip-scale integration for the semiconductor industry. Complex SiP designs presently are not cost-effective.

 
Author: Chris Sellathamby, Ph.D., PEng, Adeline Chiu, M.Sc., PEng (Fellow) | Visits: 1913 | Page Views: 1933
Domain:  High Tech Category: Semiconductors Subcategory: Nanotechnology 
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Short URL: https://www.wesrch.com/electronics/pdfEL1SE1INKVAQL
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Contents:
Faster, Smaller and Greener

2008 Alberta Nanotech Showcase

Overview � Today's nanometer-scale Integrated Circuits (IC's) call for extensive changes in all facets of the design flow. � The need for advanced interconnects and packages have become more critical. � Mechanical issues and contact probing restrictions prevent testing during 3D multi-chip assembly process � IC assembly and packaging flows are susceptible to yield excursions

12 January 2009

Confidential

Page 2

Agenda

� � � �

Introductions High level overview of Scanimetrics Overviews of Scanimetrics' products Discussion

12 January 2009

Confidential

Page 3

The Company

Scanimetrics sells products to the semiconductor industry that enable a new level chip-scale integration
� � � � � Operations began Q3/03 Based in Edmonton, AB Well financed 14 FT Employees (+ 14 PT) 17 patents

12 January 2009

Confidential

Page 4

The Technology

� Inductive chip-scale communications � Micro Tx/Rx on chip � One Tx/Rx per I/O � High speed � Low power � Pitch scales to
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