Applied Materials ENDURA: Over 20 Years of Metallization Leadership

Applied Materials ENDURA: Over 20 Years of Metallization Leadership

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Description: History and success of Applied Materials' Endura Platform. It has created over $20B of sales since the introduction is 1990. Endura is the undisputed leader in metallization processes over three decades.

 
Author: Risto Puhakka (Fellow) | Visits: 2087 | Page Views: 3323
Domain:  High Tech Category: Semiconductors Subcategory: Deposition (ALD, CVD, PVD) 
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Contents:
The Chip Insider ®

April 3, 2014

Equipment & Emerging Markets
Applied Materials ENDURA: Over 20 Years of
Metallization Leadership
‡ Introduced in April 1990
‡ Aggressive Marketing around The World
‡ Endura is the Most Successful Platform
‡ Revenues exceed $20B
Supporting Material
‡ Extension from PVD to CVD/ALD
‡ HB-LED Pricing
‡ Complex Process Integrations
‡ VLSIresearch Appears
Next @
‡ Success Endures

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ENDURA Introduced in April 1990
‡ First staged vacuum architecture
‡ First ultra-high vacuum (10-9 torr)
production system
± Electromigration reduced by factor of nine

‡ Continuous vacuum between processes
± Five stage vacuum with high integrity

‡ Most complex platform to demonstrate
>90% uptime
± First platform to use magnetically coupled
vacuum robots
± Single central block of aluminum

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Aggressive Marketing around The World

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Sales Soared and Share went Vertical

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Over 20 years of metallization leadership
‡ Undisputed leader across 3 decades
‡ Expansion of applications and films
‡ Original Endura specs included
integration of processes:
± CVD, WCVD
± RTP
± Etch & Cleaning

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ENDURA is the most successful platform
The longest running major platform
1st Gen Ionized PVD

2nd Gen Ionized PVD

3rd Gen Ionized PVD

RF PVD
SIP & EnCoRe
IMP
Collimation &
Long Throw

Standard PVD

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Blanket PVD Films

PVD for Film Coverage

20 Years of CVD/ALD

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Over 100 Processes Drive the Revenues

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More Than PVD
Endura is driven by:

Key technologies available:

‡ Device performance and yield
solutions
‡ Precision Materials
Engineering leadership

‡ PVD
‡ CVD
± Thermal & Plasma Enhanced

‡ ALD
± Thermal & Plasma Enhanced

‡ Chemical Cleans

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Complex Process Integration
Enables Challenging HVM applications
Flexibility:
‡ To meet demanding integration requirements
±

Results in both performance and cost benefits

System reliability:
‡ Enabled up to 7 integrated process steps
±

In high volume manufacturing for multiple nodes

Metal Gate:
‡ Integrated PVD, CVD, and ALD technologies that
have enabled the first generation of metal gate in
high volume production
‡ ALD deposition for conformal films
‡ RF PVD deposition for low damage high purity
PVD metal
‡ Integrated PVD or CVD wetting layers and
CVD/PVD Al Fill

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Endura Platform ± Success Endures
Continuous Refinement
‡ Capability upgrades for manufacturing at 22nm node
and below
‡ Improvements for defect reduction and backside
metal contamination
± Minimum contact wafer transfer blades / electrostatic discharge
control
± Engineered lift pins and minimum contact points
± Electrostatic chuck and pedestal contact points
± High performance coatings on components
± Coordinate system and chamber moves with optimized motion
profiles
± Advanced slit door materials with specialized movements to
minimize defect creation
± Optimized gas flow patterns, specialized diffusers and pressure
equalization routines

‡ Defect performance at 40nm defect size

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Thank You
If you have further questions, contact us at:
clientservices @ vlsiresearch.com
or visit us at

VLSIresearch.com

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Terms and Conditions, Notices, Disclaimers, etc.

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