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New Air Cavity Plastic Packages

 Chong-Ha 'Chris' Lee, Ph.D., Technical & Marketing Director, SEWON Semicon
  12th-Nov-2008
Description: Conversion & Improvement for MMIC Package Leadless Air Cavity Plastic Package for High Performance Reliability TestReliability Test Moisture Sensitivity ClassificationMoisture Sensitivity Classification Structure of LACPsic Structure of LACP
Views: 1907
Domain: Electronics
Category: Semiconductors
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Contents:
SSI New Air Cavity Plastic Packages

www.sewon-semicon.com

2002. Aug.

Chong-Ha 'Chris' Lee, Ph.D. Technical & Marketing Director : +82-43-879-3168 fax : +82-43-879-3020 Cellular : +82-16-380-8180 Email : chris_lee@sewon-semicon.com

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