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TSV Interconnect Challenges and Collaboration

 Sitaram Arkalgud
  13th-Jan-2011
Description: 3D TSV Interconnect Program, 3D TSV An industry game changer, Major industry challenges in 3D, SEMATECH’s 3D activities, 3D TSV collaborations, Worldwide 3D TSV members, Focus area for SEMATECH program, Scope of TSV development, 3D equipment capability, SEMATECH 3D ecosystem development, SEMATECH Workshops on Stress Management, 3D ICs Using Through Silicon Vias, SEMI/SEMATECH 3D Interconnect Challenges, SEMATECH Workshop on 3D Interconnect Metrology
Views: 3259
Domain: Electronics
Category: Semiconductors
Contributing Organization: SEMI
 ‐ More of their Presentations
Contents:
Accelerating the next technology revolution

3D TSV Interconnect Program - An Overview

Sitaram Arkalgud Director 3D Interconnect
Copyright �2010 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servi ... See more

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