Two Packaging Courses Added to Fall Schedule

 Peggy Evans
  4th-Jul-2017
 199

A number of you have asked about our packaging courses, and we're responding. We have set up our IC Packaging Design and Modeling Course, along with our IC Packaging Technology Course, to run this fall in Dallas. We don't run these courses very often, so this is a great opportunity to participate in a "deep dive" into today's packaging issues.

Also, we have our Failure Analysis and Semiconductor Reliability and Production Qualification Courses scheduled as well.

These courses represent an important opportunity to gain the skills you need to be successful in your job function.

Failure and Yield Analysis on September 11-14, 2017 (Mon.-Thurs.) in San Jose, CA, USA

Semiconductor Reliability and Product Qualification on September 18-21, 2017 (Mon.-Thurs.) in Portland, OR, USA

IC Packaging Design and Modeling on September 25-26, 2017 (Mon.-Tues.) in Dallas, TX, USA

IC Packaging Technology on September 27-28, 2017 (Wed.-Thurs.) in Dallas, TX, USA

Failure and Yield Analysis on April 9-12, 2018 (Mon.-Thurs.) in Munich, Germany

Wafer Fab Processing on April 9-12, 2018 (Mon.-Thurs.) in Munich, Germany

Semiconductor Reliability and Product Qualification on April 16-19, 2018 (Mon.-Thurs.) in Munich, Germany

http://www.semitracks.com/broadcasts/course-update.php

Domain: Electronics
Category: Semiconductors
Contributing Organization:
Posted By: Peggy Evans and Contact Peggy Evans
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