Grenoble-Monbonnot, France, October 6, 2008 – Altatech Semiconductor, a global provider of advanced processes and manufacturing equipments for semiconductor industry, today introduces major enhancements to AltaSight®, its full field high throughput wafer macro inspection system. Following the successful introduction of its AltaSight® ultrafast wafer inspection tool last year, Altatech is pleased to announce the addition of a Double Side Inspection option (DSI) to its product range.
The unique concept of wafer positioning allows the system to simultaneously inspect the front side and the back side of the wafer (200/300 mm), while the throughput remains at a high 100 wph.
Jean-Luc Delcarri, President of Altatech, commented the enhancement: “This addition to our product range makes the AltaSight® DSI the only inspection tool on the market capable of a high throughput wafer inspection (on both sides in parallel), and further strengthens our position as an innovative and dynamic equipment supplier to the global semiconductor industry”.
This new patented capability is field retrofitable on all existing AltaSight® SL300 systems, and will be available for new system orders from October 2008
Following the addition of simultaneous front and back side macro inspection capability for bare wafer and engineered substrates, Altatech is pleased to announce the introduction of a further advanced function on its AltaSight®, product line: the darkfield inspection.
The independent dark field station will upgrade the AltaSight® to enable to detect defects and particles down to the1µm range. As the company focus remains on productivity, the darkfield inspection is performed during hidden time, thus maintaining the exceptional high throughput of 100 wph in production.
“This makes the AltaSight® the only system offering nanometer sensitivity for slip lines detection at 100wph, with double side inspection and advanced macro inspection capability in parallel” commented Jean-Luc Delcarri. “In a fab production line, this allows the replacement of several tools using different technologies with only one system without compromising on throughput”.
This new patented dark field module will be available for shipments of AltaSight® tools starting February 2009.
Based on Altatech disruptive technology to replace human inspection with ultrafast and 100% reliable wafer inspection, AltaSight® is the first product from Altatech‘s Nanovision division. Lauched in 2007, AltaSight® targets slip lines detection on bare wafers and engineered substrates with unmatched performances, displaying a 100 wafers per hour throughput for defects down to 5 nanometers height, with limited edge exclusion (99.9% surface coverage).
Altatech is a global provider of advanced processes and manufacturing equipments for the semiconductor industry and nanotechnologies. The product range includes Nanovision with AltaSight® (Inspection), Nanoprinting with AltaDrop® (Inkjet equipment), Nanodeposition with AltaCVD®. Besides its own tools, Altatech’s reengineering activity offers its customers remanufactured production tools. Altatech was founded in 2003 and is headquartered in Grenoble-Montbonnot with subsidiary office in Germany and distributor in Japan.
For more information, please visit :http://www.altatech-sc.com
Altatech: Jean-Luc Delcarri, CEO
Phone : +33 456 526 800
Mail : firstname.lastname@example.org
l’Ops press office : Chantal Cochini
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