Ziptronix process enables 3D integration on Raytheon ICs

 David Lammers
25_1175782257_1.jpg Ziptronix Die-to-Wafer process enables 3D integration|Cross section of focal plane array|Image created with Raytheon 3d image IC|||
MORRISVILLE, N.C., – Ziptronix, Inc., a leader in innovative 3D integration solutions, in conjunction with Raytheon Vision Systems (RVS), has proven its patented Direct Bond Interconnect (DBIÔ) technology to be compatible with multilayer CMOS IC processes. Demonstration of the compatibility involved the 3D integration of five-layer metal 0.5 micron CMOS devices with silicon PIN detector devices for high-performance imaging applications including focal plane imagers and high performance sensor arrays.
The Ziptronix DBI™ interconnect technology achieves high-density vertical interconnections without any volume exclusions (i.e. without “wasted space” for the interconnect) in the CMOS device. It supports an interconnect pitch of less than 10 microns, with typical interconnect width of 2 µm and alignment accuracy of 1 µm. The DBI™ interconnectivity yield for a majority of the initial devices was 100%, for parts with more than one million vertical connections.
DBI™ can be implemented in a die-to-wafer or a wafer-to-wafer format. The RVS parts were built in a die-to-wafer format with an interconnection pitch of 8 microns. The 100% interconnectivity allowed a 100% pixel operability focal plane.
“We evaluated several technologies for 3D integration as part of this development program,” said Stefan Baur, Raytheon Vision Systems' Director for Advanced Technology, “and Ziptronix’s DBI technology proved to be an appropriate solution in terms of cost, manufacturability and yield.”
DBI™ technology enables silicon and other technologies to be bonded and interconnected in a 3D fashion, thus maximizing signal-path density among all transistors and enabling economic, power-efficient and high-performance mixed-signal systems. DBI™ is part of Ziptronix’s ZiBond™ direct-bond technology, which employs covalent bonding energy to create high-strength, hermetic bonds between chips at room temperature. With DBI™, the metal interconnect points of each chip are first exposed, using standard CMP techniques. Then, as the chips are bonded, the high bond energy draws the respective exposed metal contact points close together automatically, forming low-resistance effective electrical interconnections between the chips. Alignment accuracy is preserved because ZiBond™ does not require externally applied heat and/or pressure.
“With the Raytheon project, we successfully applied our planar DBI™ technology to achieve a very high 3D integration density with a multi-level CMOS process,” says Paul Enquist, CTO and vice president of research and development with Ziptronix. “The ability of our technology to use existing equipment operating at room temperature without applying external pressure gave us a distinct advantage over other 3D integration technologies.”
Many other 3D IC integration processes require large area exclusions to route the interconnect. These not only consume valuable real estate on the chip, they disrupt at least one if not all metal wiring layers in the interconnect stack of an IC. DBI™ technology allows for direct vertical interconnections to be made between ICs as part of the bond process, with no disruption and compromise to the interconnect stack. With DBI™, 3D IC cost is minimized because area exclusions are avoided and because the vertical interconnections between IC layers in a 3D IC scale with the process nodes.
The Ziptronix DBI™ technology is available for licensing. For more information, contact Ziptronix at, call 919-459-2400 or visit
About Ziptronix
Founded in October 2000, Ziptronix was spun out from North Carolina’s RTI International for the purpose of commercializing a revolutionary wafer and die bonding technology. Setting the next generation standard for the manufacturing of integrated circuits, Ziptronix’s mission is to deliver innovations to the electronics industry, and continually advance the way semiconductor products are designed and manufactured.
Ziptronix lowers the high manufacturing and packaging costs and increases the yield associated with high-speed logic and MEMS manufacturing. Ziptronix licenses its technology to enable its customers to quickly install and qualify the Ziptronix processes on standard equipment running at room temperature. These technologies are enabling the creation of true 3D integrated circuits at the gate level by delivering significant advantages including: size reduction, drastically reduced production costs, lower power consumption and increased system speed and performance.
About Raytheon Vision Systems

Raytheon Vision Systems develops and produces state-of-the-art detection and imaging devices for applications in the x-ray, visible, infrared, terahertz and millimeter wave regions of the electromagnetic spectrum.

Domain: Electronics
Category: Semiconductors
Contact Person Address: Ziptronix
Posted By: David Lammers and Contact David Lammers

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