Samsung Package-on-Package device combines mobile application processor with SDRAM and NAND Flash me

 Richard Yeh
  18th-Jan-2008
Views: 2205
Domain: Electronics
Category: Semiconductors
SEMICONDUCTOR ANALYTICS
Contents:
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Product Design for the 21st Century

Moving Ahead with New PoP Configuration
Richard Yeh Associate Director of Strategic Marketing, System LSI Division

New Samsung Chip Gives Engineers Flexibility and Smaller Form Factors
Package-on-Package device combines mobile application processor with SDRAM and NAND Flash memory

Samsung Semiconductor Inc.
"This represents the future direction ... See more

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