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SYSTEM-IN-PACKAGE TECHNOLOGY, APPLICATION AND TRENDS

 Christopher M. Scanlan and Nozad Karim
  28th-Oct-2007
Views: 2389
Domain: Electronics
Category: Semiconductors
Contents:
SYSTEM-IN-PACKAGE TECHNOLOGY, APPLICATION AND TRENDS
Christopher M. Scanlan and Nozad Karim, Amkor Technology, Inc. For more information please contact Marketing@amkor.com
INTRODUCTION As a concept, "System in Package" or "SiP" relates to the objective of merging many or all of the electronic requirements of a functional system or a subsystem into one package. It is a concept that can at once be u ... See more

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