Posted on: 02-Dec-2008
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Covers how packaging technology developed by Intel made Appleís MacBook Air thinness possible was. Nasser heads Intel's Package Technology Development. Also: packaging as an enabling technology below 90nm. Integrated packaging solutions to meet design performance potential, be cost effective. Material interactions strained silicon, copper, and low-k dielectrics. MCP-Multi-Chip-Packages and DCA-Direct Chip Attach OEM advantages. RoHS Directive engineering challenges.
weQuest's are written by G Dan Hutcheson, his career spans more than thirty years, in which he became a well-known as a visionary for helping companies make businesses out of technology. This includes hundreds of successful programs involving product development, positioning, and launch in Semiconductor, Technology, Medicine, Energy, Business, High Tech, Enviorntment, Electronics, healthcare and Business devisions.