Paper of the Week awarded to Bill Arnold, Gene Fuller, and Phil Ware. Press Release of the Week and News of the Week
Posted on: 22-Jan-2008
Page Views: 1694
The paper of the week award goes to my lithography panel video, which included Bill Arnold, Gene Fuller, and Phil Ware and focused on were each saw the technology going. This was its second week at the top.
Second is awarded to TSMC’s paper on their excellent process technology at the 65/55nm node.
Third goes to the U.S. Commercial Service’s Kelly Smith-Grover for her write-up on the chip equipment market in
Fourth is awarded to Paul Magill’s paper on thermal copper pillar bumps and how they can can be used to more efficiently cool devices.
Finally, Fifth goes George Scalise for his video interview on the America Competes act sham.
Hottest Papers uploaded over the past two weeks:
The press release of the week is awarded to Karl von Gunten and Garth Miller for their release on Nextreme’s new microscale thermal and power management products for the electronics industry.
Hottest Press Releases uploaded over the past two weeks:
Also, here’s some of the most popular articles over the last seven days that I found interesting:
On the Electronics side:
On the medical side:
And finally, in Energy:
weQuest's are written by G Dan Hutcheson, his career spans more than thirty years, in which he became a well-known as a visionary for helping companies make businesses out of technology. This includes hundreds of successful programs involving product development, positioning, and launch in Semiconductor, Technology, Medicine, Energy, Business, High Tech, Enviorntment, Electronics, healthcare and Business devisions.