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IBM's 32nm Hi-K Chip Technology

Posted on: 29-Apr-2008

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Summary

An interview with Gary Patton, Vice President of the Semiconductor Research and Development Center of IBM’s Systems and Technology Group, on the business tactics behind their implementation of Hi-K strained silicon, Air Gap, & eDRAM as well as their strategy of reducing design costs for 32nm. Find out why some companies are skipping nodes and how they are able to do it.

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About weQuest:
weQuest's are written by G Dan Hutcheson, his career spans more than thirty years, in which he became a well-known as a visionary for helping companies make businesses out of technology. This includes hundreds of successful programs involving product development, positioning, and launch in Semiconductor, Technology, Medicine, Energy, Business, High Tech, Enviorntment, Electronics, healthcare and Business devisions.

Short URL: https://www.wesrch.com/electronics/weqEL1EH7P

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