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FinFET vs FDSOI in the jump to 7nm

 Gary Patton     GLOBALFOUNDRIES Inc.
  31465      Oct 15, 2015
Summary: GF's roadmap to 10 and 7nm for finFET and FDSOI: A lot has happened since we last interviewed someone from GLOBALFOUNDRIES. So there’s lot’s to cover: There is the integration of the IBM acquisition, the RF, Analog, and Mixed Signal IP that came with it. Plus there’s a rich team of technical talent that came over, not to mention 14nm’s production status, as well as their roadmap for 10 and 7nm. But the most important new thing to talk about is their new 22nm FDSOI process. It looks to be a real game changer and GF is the only foundry with it. We find out why and what it does that finFET and ordinary planar processes can’t. Dan Hutcheson has a conversation about this with Gary Patton, from GLOBALFOUNDRIES, where he’s CTO and head of Worldwide R&D. Gary’s one of the most respected technology leaders in the world, having brought multiple generations of chip nodes to production at the head of IBM’s Semiconductor Research and Development Center.
About weVISION: weVISION is a series of video interviews of visionaries by G Dan Hutcheson, his career spans more than thirty years, in which he became a well-known as a visionary for helping companies make businesses out of technology. This includes hundreds of successful programs involving product development, positioning, and launch in Semiconductor, Technology, Medicine, Energy, Business, High Tech, Environment, Electronics, healthcare and Business divisions.

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