Prev

IBM's 32nm Hi-K Chip Technology: An interview with Gary Patton

 Dr. Gary Patton     IBM
  2792      Apr 29, 2008
Summary: IBM’s 32nm Hi-K Chip Technology: An interview with Gary Patton, Vice President of the Semiconductor Research  and Development Center of IBM’s Systems and Technology Group, on the business tactics behind their implementation of Hi-K strained silicon, Air Gap, & eDRAM as well as their strategy of reducing design costs for 32nm. Find out why some companies are skipping nodes and how they are able to do it.
About weVISION: weVISION is a series of video interviews of visionaries by G Dan Hutcheson, his career spans more than thirty years, in which he became a well-known as a visionary for helping companies make businesses out of technology. This includes hundreds of successful programs involving product development, positioning, and launch in Semiconductor, Technology, Medicine, Energy, Business, High Tech, Environment, Electronics, healthcare and Business divisions.
Important Tags: Gary Patton eDRAM

You may like this also:

Invest in Sofia
14 November, 2018
...
13 November, 2018
...
12 November, 2018
Andrea Lati
09 November, 2018
...
09 November, 2018
Mike Cowan
08 November, 2018
...
08 November, 2018
...
07 November, 2018

Recent weVISIONs

2018 Survey of Semiconductor Mask Makers ... with Aki Fujimura of D2S
Aki FujimuraeBeam Initiative
16 October, 2018
GLOBALFOUNDRIES' Strategic Pivot ... a conversation with Tom Caulfield
Tom CaulfieldGLOBALFOUNDRIES
12 September, 2018