Prev Next

weVISION: Vertical Reality - 3D TSV ... with Rick Hill

 Rick Hill     Novellus Systems Inc.
  12032      Aug 19, 2010
Summary: In this interview we delve into what’s new in packaging and how their new products help chip makers drive down costs and raise yields. Novellus recently introduced a complete line of new products that address longstanding issues in TSV, such as heavy electrofill overburdens  that slow down CMP and drive up costs. Rick talks not only about how Novellus is striving to eliminate CMP, which is not a value added step, but also about how the company’s newest systems help to reduce voids and defects.
About weVISION: weVISION is a series of video interviews of visionaries by G Dan Hutcheson, his career spans more than thirty years, in which he became a well-known as a visionary for helping companies make businesses out of technology. This includes hundreds of successful programs involving product development, positioning, and launch in Semiconductor, Technology, Medicine, Energy, Business, High Tech, Environment, Electronics, healthcare and Business divisions.

You may like this also:

...
19 July, 2018
...
18 July, 2018
...
17 July, 2018
Saeed Ullah Jan
16 July, 2018

Hacking Innovation

They are feared, glamorized, and hated. Rarely does a day go by without headline news coverage of the wreckage left behind by malicious hackers. They hack corporations, governments

Josh Linkner
14 July, 2018
Andrea Lati
13 July, 2018
Joe Klein
13 July, 2018

Computer Ethics and Security

The protection of information and its critical elements (confidentiality, integrity and availability), including the systems and hardware that use, store, and transmit that informa

...
12 July, 2018

Recent weVISIONs

VLSI's 2H18 Forecast ... a conversation with Andrea Lati of VLSIresearch
Andrea LatiVLSIresearch Inc
10 July, 2018
VLSI's Annual Forecast ... a conversation Andrea Lati of VLSIresearch
Andrea LatiVLSIresearch Inc
15 January, 2018