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Shifting Winds in the Semiconductor Supply Chain . . . with Dan Armbrust (video)

 Dan Armbrust     SEMATECH
  8016      Feb 3, 2011
Summary: The verticalization of Semiconductor Supply Chain along with the increased interlinking of design, manufacturing, and packing are creating new challenges for IDMs, Foundries,and the fabless alike. In this interview with Dan Armbrust, President and CEO of SEMATECH, we examine how this world is changing and what it means for customers and suppliers alike. 

As the industry dived below the 50nm node, cracks began to develop in the fablessfoundry business model. Its great run is struggling to move forward with a simple bilateral supplier-customer approach. A multi-lateral model similar to the one developed years ago where different companies collaboratively develop precompetitive technologies has begun to look more attractive. 

This video starts with a discussion of these challenges and explores how new multilateral business models fabless-foundries are changing the product development dynamics of the semiconductor industry. Dan discusses how technologies such as 3D interconnect and packaging are changing the receptiveness of the large body of companies that compete as fabless, foundry, or subcon to working through consortia to reach new technical milestones more cost effectively. 
About weVISION: weVISION is a series of video interviews of visionaries by G Dan Hutcheson, his career spans more than thirty years, in which he became a well-known as a visionary for helping companies make businesses out of technology. This includes hundreds of successful programs involving product development, positioning, and launch in Semiconductor, Technology, Medicine, Energy, Business, High Tech, Environment, Electronics, healthcare and Business divisions.

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