Plasma etch has never been as challenged as it is today by the transition from planar NAND flash structures to 3D. The incredible cost-per-bit reduction of NAND that has made smartphones and tablets economically viable will not continue unless the High Aspect Ratio Etching needed for 3D can be met. Applied Materials has just introduced its Centura Avatar etch system to address these needs. In this interview we discuss how this new tool gets 3D NAND closer to production by setting new benchmarks for High Aspect Ratio Etching of near vertical multi-material stacks and being able to simultaneously etch multi-depths to enable new staircase architectures.
weVISION is a series of video interviews of visionaries by G Dan Hutcheson, his career spans more than thirty years, in which he became a well-known as a visionary for helping companies make businesses out of technology. This includes hundreds of successful programs involving product development, positioning, and launch in Semiconductor, Technology, Medicine, Energy, Business, High Tech, Environment, Electronics, healthcare and Business divisions.